Master Bond Inc.
Having trouble viewing images? View email in browser
Video on Silver Conductive Epoxy EP4S-80
One Part, Silver Filled Epoxy for EMI/RFI Shielding
Master Bond EP4S-80 is a one component, silver filled epoxy that cures at 80˚C and bonds well to a variety of substrates. See how this low viscosity compound can be brushed on or dispensed through a syringe.
UV17Med video on TPU Bonding for Medical Manufacturing
Medical Grade UV Curable Adhesive for TPU Bonding
While bonding thermoplastic polyurethanes (TPUs) is known to be challenging, Master Bond has formulated UV17Med, a UV curable adhesive specially formulated for bonding many variations of TPUs.
EP41S-5 Case Study
Utilized in Development of Microfluidic Particle Generator
Master Bond EP41S-5 offers solvent and heat resistance making it the ideal fit for bonding steel compression fittings to glass wafers for use in this all-silicon/glass microfluidic particle generator.
EP30Med Case Study
Utilized as a Sensor Encapsulant in Prosthetic Device
Find out how researchers at the University of Tennessee were able to successfully utilize Master Bond EP30Med in their diagnostic tools which were then implanted into a prosthetic device.
Mechanical Strength of Adhesive Systems
Testing Mechanical Strength of Adhesives
Master Bond offers a look into the accurate, repeatable and reproducible testing methods we use to test the mechanical strength of our adhesive compounds.
+ Learn more
Adhesives Resist Acetone
Testing Adhesives for Acetone Resistance
Master Bond tested a variety of epoxies for their resistance to acetone. Cured samples of epoxy were immersed over a long period of time in acetone and weight changes were recorded weekly.
+ Learn more
Master Bond Facebook Master Bond LinkedIn Master Bond Twitter Master Bond LinkedIn

Master Bond Inc. | | | +1.201.343.8983
154 Hobart Street, Hackensack, New Jersey 07601 USA

Copyright © 2022 by Master Bond Inc. All Rights Reserved.
This content may not be reproduced in any way without the prior written permission of Master Bond Inc.