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Using the Dam & Fill Method to Protect Electronic Components
Watch demonstration on how to apply dam and fill compounds
Master Bond Video
Get an up close look at how the dam and fill process works to protect electronic components on a circuit board. This two step method utilizes a damming compound such as Supreme 3HTND-2DM-1 to create a barrier around the component, while the flowable filler material, EP3UF-1, covers the component for protection.
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