Impregnation Applications

Master Bond EP112 is an ultra-low-viscosity, electrically insulating, two-component epoxy system ideal for various applications. This two-part case study series presents two use cases for EP112 for microelectronics fabrication processes when used to bond a silicon wafer to a glass substrate.

Since its introduction in 1978, Master Bond EP29LPSP has been the epoxy compound of choice in a variety of challenging applications. Ideal for demanding cryogenic environments, two-part EP29LPSP can withstand temperatures as low as 4K and can resist cryogenic shock when, for instance, it is cooled from room temperature to cryogenic temperatures within a 5-10 minute window. Optically clear EP29LPSP has superior physical strength, electrical insulation, and chemical resistance properties. It also meets NASA low outgassing requirements and exhibits a low exotherm during cure. This low viscosity compound is easy to apply and bonds well to metals, glass, ceramics, and many different plastics. Curable at room temperature, EP29LPSP attains its best results when cured at 130-165°F for 6-8 hours. In over a dozen published research articles, patents, and manufacturers’ specifications, scientists and engineers have identified EP29LPSP for use in their applications due to its unparalleled performance in one or more areas. Table 1 highlights several commercial and research applications that use Master Bond EP29LPSP. Table 2 summarizes several patents that reference EP29LPSP. Following each table are brief descriptions of the role Master Bond EP29LPSP plays in each application or invention.Table 1: Commercial and Research Uses of EP29LPSPIndustryApplicationEP29LPSP UseCritical PropertiesPlasma PhysicsExperimental device to study magnetic reconnection events1Fabrication of flux core assembliesCryogenic Low outgassingAstronomyInfrared telescope system2Optical fiber mounting assemblyCryogenic Low outgassing Long cure time Low shrinkageAeronauticsTesting of a miniature ramjet model in a supersonic wind tunnel4Bonding strain gauges to flexure beamsSufficient flexibility at cryogenic temperaturesParticle PhysicsArgon detector5Coat metal rim to electrically insulate itCryogenic Low outgassingElectrical insulationParticle PhysicsRadioactive decay detector6Bond flexible cable to flangeLow outgassingNeuroscienceNeurophysiological mechanism of magnetic stimulus in primates11Mechanism to impregnate mini coil during winding processLow viscosity impregnationSpacecraftAttach MLI blanket to spacecraft to survive acceleration, acoustic nd venting loads while minimizing heat load to tank12Configuration of a standoff with an MLI blanketHigh tensile and shear strengthat cryogenic temperaturesTable 2: Patent Grants that Reference EP29LPSPApplicationEP29LPSP UseCritical PropertiesCryogenic refrigerator7Bond thermally insulated tubes to thermal tube couplersCryogenic Low outgassing Thermal shock resistantProton Exchange Membrane (PEM) fuel cell8Rigidizing a fluid flow plate assemblyElectrical insulationPhysical strengthStructural health monitoring (SHM) system9Affix transducers to structure under testCryogenic Withstand vibrationsFiber optic gyroscopes10Construction of fiber optic sensing coilCryogenic Low outgassingDownload full case studyConclusionThe success of any engineered product depends on the performance of all of its parts, including any chemical compound used to join or protect one or more parts. If an adhesive, coating, or potting compound fails, the product fails. Leading companies, research labs, and inventors around the world rely on Master Bond EP29LPSP to perform unfailingly in extremely demanding applications.Sources1Manufacturing Specification and Statement of Work: FLARE (Facility for Laboratory Reconnection Experiments) Project —Fabrication of Flux Core, FLARE-Spec-03-Rev.00, WP1995, Revision 0, Princeton University Plasma Physics Laboratory, 19 Mar. 2015. https://flare.pppl.gov/Construction/FLARE%20FCSpec-03%2019Mar15.pdf . Accessed September 2023.2Lee, David, et al. Properties of optical fibres at cryogenic temperatures. Monthly Notices of the Royal Astronomical Society, vol. 326, no. 2, 11 Sept. 2001, pp. 774-780. ResearchGate, doi: 10.1046/j.1365-8711.2001.04630.x. Accessed 2 Aug. 2017.3 Reference Surfaces for Scanner Calibration Phoenix Scientific Inc., 2002, www.phnx-sci.com/PPS/Downloads_files/AN2002-01%20Ref%20Surface%20for%20Calibration.pdf. Accessed 2 Aug. 2017.4Chen, Bingqiang. Numerical Performance Prediction of a Miniature Ramjet at Mach 4, MS thesis, Naval Postgraduate School, 2012. https://apps.dtic.mil/sti/citations/tr/ADA567441. Accessed September 2023.5 Xu, Jingke. Study of Argon from Underground Sources for Direct Dark Matter Detection. Dissertation, Princeton University, 2013.6 Hsu, Scott C. Experimental Study of Ion Heating and Acceleration During Magnetic Reconnection. N.P. June 2000. July 2016. http://www.osti.gov/scitech/servlets/purl/7509777Snow, David, et al. “Apparatus and methods for improving vibration isolation, thermal dampening, and optical access in cryogenic refrigerators.” US Patent 8,756,941. 24 Jun. 2014.8Walsh, Michael M. “Fuel cell assembly fluid flow plate having conductive fibers and rigidizing material therein.” US Patent 6,096,450. 1 August 2000.9 Qing, Xinlin, et al. “Method and apparatus for conducting structural health monitoring in a cryogenic, high vibration environment.” US Patent 8,347,722. 8 January 2013.10 Chappell, Charles D. and Kara L. Warrensford. “Systems and methods for controlling the gas conversion in a fiber-optic gyroscope.” US Patent 9,182,230. 10 November 2015.11 Tischler, Hadass. Wolfus, Shuki. Friedman. Alexander. Perel, Eli. Pashut, Tamar. Lavidor, Michal. Alon Korngreen, Alon. Yeshurun, Yosef. Bar-Gad, Izhar. “Mini-coil for magnetic stimulation in the behaving primate.” Bar Ilan University, Ramat Gan, Israel. June 12, 2010. Revised September 28, 2010.12 Alberts, S.J., Doehne, C.J., and Johnson, W.L. “Testing Tensile and Shear Epoxy Strength at Cryogenic Temperatures.” https://ntrs.nasa.gov/archive/nasa/casi.ntrs.nasa.gov/20170009145.pdf. Accessed May 2020.

Master Bond EP62-1LPSP delivers an array of strength, electrical and handling properties that are well suited for bonding, sealing, coating and encapsulation applications. With a tensile lap shear strength exceeding 2,000 psi, it bonds well to a variety of substrates including metals, composites, glass and many plastics. This optically clear epoxy has a non-critical four to one mix ratio by weight and features an open time of 12-24 hours at ambient temperatures. EP62-1LPSP has a thin mixed viscosity of 150-300 cps, which can be further lowered by adding heat. Its low exotherm while curing allows it to be used for large encapsulations. It offers a variety of cure schedules and can be cured at temperatures as low as 60-70°C. Faster cures can be achieved at 125°C. Featuring a glass transition temperature of greater than 125°C, EP62-1LPSP is a thermally stable system that is serviceable over the wide temperature range of -60°F to +400°F. It withstands exposure to chemicals such as water, fuels, oils, solvents, acids and bases. EP62-1LPSP is a reliable electrical insulator and has a volume resistivity over 1014 ohm-cm. This blend of high performance properties allows this product to be used in aerospace, electronic, fiber-optic, optoelectronic and specialty OEM applications. EP62-1LPSP is available for use in standard ½ pint, pint, quart, gallon and 5 gallon kit containers. It can be applied by brush, paint roller, syringe or gun dispenser.

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. EP29LPSP is serviceable at temperatures as low as 4K as an adhesive, sealant and protective coating, but more importantly, it is able to withstand cryogenic shocks (i.e. room temperature down to liquid helium temperatures in a 5-10 minute time period).