Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP3HTSCN One part, high performance, electrically conductive epoxy Tensile Lap Shear Strength 900-1,100 psi Volume Resistivity 0.05 to 0.10 ohm-cm	RoHS Compliant	Coating Bonding Sealing Gap Filling	paste	cures readily at 250°F at 45-50 minutes or in just 20-30 minutes at 300°F	75-85 Shore D	-60°F to +400°F	/es/tds/ep3htscn
EP3HTSDA-2Med One component, medical grade, electrically conductive epoxy featuring exceptionally high thermal conductivity Thermal Conductivity 45-49 BTU•in/(ft²•hr•°F) W/(m•K)] Volume Resistivity <0.001 ohm-cm	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Die Attach Gap Filling Sealing Coating	>400,000 cps	250°F for 20-30 minutes, 300°F for 5-10 minutes	75-85 Shore D	-80°F to +450°F	/es/tds/ep3htsda-2med
EP3HTSMed One part, electrically conductive, biocompatible epoxy system Tensile Lap Shear Strength >400 psi Volume Resistivity <0.001 ohm-cm	USP Class VI Medical RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	40-90 minutes at 250°F or 20-40 minutes at 300°F (minimum cure temperature is 235-240°F)	60-80 Shore D	-60°F to +400°F	/es/tds/ep3htsmed
EP3RR-80 One component epoxy system for bonding, sealing, potting and encapsulation applications featuring curing temperatures of 175-180°F or higher Dielectric Constant 4.4 Volume Resistivity 10¹⁴ ohm-cm	MIL-STD-810G for Fungus Resistance NASA Low Outgassing 1,000 Hours at 85°C/85% RH RoHS Compliant	Sealing Encapsulation Potting Bonding	60,000-120,000 cps	Cure in 45-50 minutes at 175-180°F, or in 25-30 minutes 250°F	80-90 Shore D	-100°F to +350°F	/tds/ep3rr-80
EP3SP5FL-ND2 One component “snap cure” epoxy adhesive with paste viscosity Elongation 10-15% Tensile Lap Shear Strength >2,000 psi	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	1-2 minutes at 300°F	>85 Shore D	-60°F to +200°F	/tds/ep3sp5fl-nd2
EP3UF One component epoxy for bonding and underfill applications Dielectric Strength 450 volts/mil Volume Resistivity >10¹² ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Underfill Sealing Coating Encapsulation	10,000-40,000 cps	20-30 minutes at 250°F or 10-15 minutes at 300°F	80-90 Shore D	-60°F to +300°F	/es/tds/ep3uf
EP3UF-1 One component epoxy for bonding and underfill applications Dielectric Strength 450 volts/mil Volume Resistivity >10¹² ohm-cm	RoHS Compliant	Bonding Underfill Sealing Coating Encapsulation	5,000-15,000 cps	20-30 minutes at 250°F or 10-15 minutes at 300°F	80-90 Shore D	-60°F to +250°F	/es/tds/ep3uf-1
EP4CL-80 One component, optically clear epoxy for bonding and sealing that cures at 80°C to 85°C Glass Transition Temperature (Tg) 155-160°C Refractive Index 1.52	RoHS Compliant NASA Low Outgassing	Bonding Sealing Coating Underfill	50-150 cps	60-90 minutes at 80-85°C or 10-15 minutes at 100°C	85-95 Shore D	-80°F to +450°F	/es/tds/ep4cl-80
EP4CL-80Med One component, optically clear epoxy for bonding and sealing that cures at 80°C to 85°C for medical applications Glass Transition Temperature (Tg) 155-160°C Refractive Index 1.52	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing Coating Impregnation Underfill	50-150 cps	60-90 minutes at 80-85°C or 10-15 minutes at 100°C	85-95 Shore D	-80°F to +450°F	/es/tds/ep4cl-80med
EP4G-80 One component, graphite filled epoxy with a curing temperature of 80°C Glass Transition Temperature (Tg) 130-140°C Volume Resistivity 50-100 ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	4,000-10,000 cps	60-90 minutes at 80°C	75-85 Shore D	-58°F to +347°F	/es/tds/ep4g-80

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