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Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP114 Two component, optically clear, nanosilica filled epoxy for potting, encapsulating, coating and sealing Glass Transition Temperature (Tg) 210-215°C Tensile Modulus >1,000,000 psi	ASTM D4060-14 for Abrasion Resistance RoHS Compliant 1,000 Hours at 85°C/85% RH NASA Low Outgassing	Sealing Coating Potting Bonding Gap Filling Encapsulation Underfill	500-1,500 cps	2-3 hours at 250°F followed by 5-8 hours at 300°F with a 2 hour or longer post cure at 350°F	85-95 Shore D	-100°F to +550°F	/es/tds/ep114
EP21LVMed Low viscosity, two component epoxy compound Dielectric Strength 440 volts/mil Tensile Lap Shear Strength >2,800 psi	ISO 10993-5 for Cytotoxicity RoHS Compliant USP Class VI Medical	Bonding Sealing Coating Casting Encapsulation Potting	Part A: 10,000-14,000 cps, Part B: 11,000-15,000 cps	overnight at 75°F followed by 1-2 hours at 150-200°F	>70 Shore D	-65°F to +250°F	/es/tds/ep21lvmed
EP21TCHT-1 Two component epoxy compound for high performance bonding and sealing Coefficient of Thermal Expansion 18-21 X 10⁻⁶ in/in/°C Glass Transition Temperature (Tg) 135-140°C	MIL-STD-810G for Fungus Resistance NASA Low Outgassing RoHS Compliant 1,000 Hours at 85°C/85% RH IEC 61249-2-21 for Halogen Free	Bonding Sealing Coating Encapsulation Gap Filling	paste	overnight at 75°F followed by 2 hours at 175-200°F	85-95 Shore D	4K to +400°F	/es/tds/ep21tcht-1
EP29LPSP Two component epoxy compound for cryogenic applications Dielectric Constant 3.95 Refractive Index 1.56	RoHS Compliant NASA Low Outgassing	Bonding Sealing Coating Casting Potting Encapsulation Gap Filling Impregnation Underfill	Part A: 10,000-16,000 cps, Part B: 10 - 70 cps	Gel at room temp followed by any option listed below: 8-10 hours at 130-150°F or 5-7 hours at 175°F or 3-5 hours at 200°F	>65 Shore D	4K to +275°F	/es/tds/ep29lpsp
EP30-2 Two component, room temperature curing epoxy system for bonding, sealing, coating and encapsulation featuring a wide range of desirable properties Dielectric Constant 3.00 at 9.375 GHz Refractive Index 1.55	NASA Low Outgassing 1,000 Hours at 85°C/85% RH RoHS Compliant	Bonding Sealing Coating Gap Filling Encapsulation	Part A: 10,000-16,000 cps, Part B: 10-35 cps	24-48 hours at 75°F; 2-3 hours at 200°F	80-90 Shore D	4K to +300°F	/es/tds/ep30-2
EP42HT-2LO Two component epoxy adhesive, sealant, coating and casting system Dielectric Constant 3.8 Volume Resistivity >10¹⁴ ohm-cm	NASA Low Outgassing 1,000 Hours at 85°C/85% RH RoHS Compliant	Bonding Sealing Coating Casting Encapsulation Gap Filling	Part A: 55,000-110,000 cps, Part B: 30 - 70 cps	75°F for 48-72 hours, 200°F for 2-3 hours	80-90 Shore D	-60°F to +450°F	/es/tds/ep42ht-2lo
EP42HT-2Med Two component, high temperature resistant epoxy for medical device assembly; tested and approved for 3 medical related certifications Acoustical Impedance 3.1 MRayl Glass Transition Temperature (Tg) 150-155°C	ISO 10993-5 for Cytotoxicity USP Class VI Medical RoHS Compliant ISO 10993-10 for Skin Sensitization	Bonding Sealing Coating Potting Encapsulation Gap Filling Casting	Part A: 55,000-110,000 cps, Part B: 30 - 70 CPS	overnight at 75°F followed by 2-4 hours at 150-250°F	75-85 Shore D	-60°F to 450°F	/es/tds/ep42ht-2med
EP62-1ND Two component epoxy resin system featuring excellent temperature and chemical resistance, non-drip application Tensile Lap Shear Strength 8,000-9,000 psi Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	4-6 hours at 140-158°F [60-70°C], 20-40 minutes at 176-212°F [80-100°C] or 10-20 minutes at 257°F [125°C]	75-85 Shore D	-60°F to +450°F	/es/tds/ep62-1nd
EP65HT-1 Two component epoxy system featuring the special combination of very fast setup times and high temperature resistance Dielectric Constant 4.1 Glass Transition Temperature (Tg) 125-130°C	NASA Low Outgassing RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Gap Filling	Part A: 55,000-110,000 cps, Part B: 8,000-12,000 cps	3-5 minutes setup, full cure within 6-12 hours at 75°F	80-90 Shore D	-60°F to +400°F	/es/tds/ep65ht-1
Supreme 11HT-LO Toughened, two epoxy for bonding, sealing and coating meets NASA low outgassing Tensile Lap Shear Strength 3,200-3,400 psi Tensile Modulus 300,000-350,000 psi	NASA Low Outgassing RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Gap Filling	Part A: 90,000-120,000 cps, Part B: 60,000-110,000 cps	75°F: 24-36 hours; 200°F: 1-2 hours	75-85 Shore D	-112°F to +400°F	/es/tds/supreme-11ht-lo

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