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Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP54TCMed Two part medical grade epoxy featuring exceptionally high thermal conductivity and electrical insulation, for bonding and sealing Tensile Modulus >1,000,000 psi Thermal Conductivity 41.6-45.1 BTU•in/(ft²•hr•°F) [6.0-6.5 W/(m•K)]	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing	100,000-200,000 cps	The epoxy requires heat for curing. One option is 80°C for 2 hours followed by 2-4 hours at 90-125°C. An alternative cure schedule would be 4-6 hours at 80-90°C.	85-95 Shore D	-100°F to +400°F [-73°C to +204°C]	/es/tds/ep54tcmed
EP62-1 Two component epoxy resin system featuring excellent temperature and chemical resistance Dielectric Constant 4.2 Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant	Bonding Sealing Coating Gap Filling	4,000-8,000 cps	4-6 hours at 60-70°C, 20-40 minutes at 80-100°C or 10-20 minutes at 125°C	80-90 Shore D	-60°F to +450°F	/es/tds/ep62-1
EP62-1AO Two component epoxy resin system featuring excellent temperature and chemical resistance Dielectric Constant 4.8 Tensile Lap Shear Strength 800-1,000 psi	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	4-6 hours at 140-160°F, 20-40 minutes at 175-200°F or 10-20 minutes at 250-300°F	80-90 Shore D	-60°F to +450°F	/es/tds/ep62-1ao
EP62-1BF Two component, lower viscosity epoxy system featuring superior chemical resistance Dielectric Constant 4.2 Volume Resistivity >10¹⁴ ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Gap Filling Coating	2,000-5,000 cps	6-8 hours at 140-158°F [60-70°C], 60-70 minutes at 176-212°F [80-100°C] or 20-30 minutes at 257°F [125°C]	80-90 Shore D	-60°F to +400°F	/es/tds/ep62-1bf
EP62-1HT Two component, lower viscosity epoxy system featuring superior temperature and unsurpassed chemical resistance, especially to acids Dielectric Constant 4.2 at 75°F, 60 Hz Glass Transition Temperature (Tg) 145-155°C	RoHS Compliant NASA Low Outgassing	Bonding Sealing Coating Gap Filling	Part A: 55,000-110,000 cps, Part B: 100-1,000 cps	60-70 minutes at 176-212°F [80-100°C] or 20-30 minutes at 257°F [125°C]	80-90 Shore D	-60°F to +450°F	/es/tds/ep62-1ht
EP62-1HTMed Two component epoxy with superior temperature and chemical resistance that withstands repeated and aggressive sterilization Glass Transition Temperature (Tg) 145-155°C Volume Resistivity >10¹⁴ ohm-cm	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 55,000-110,000 cps, Part B: 100-1,000 cps	60-70 minutes at 176-212°F [80-100°C] or 20-30 minutes at 257°F [125°C]	80-90 Shore D	-60°F to +450°F	/es/tds/ep62-1htmed
EP62-1HTMed Black Two component epoxy with superior temperature and chemical resistance that withstands repeated and aggressive sterilization Glass Transition Temperature (Tg) 145-155°C Volume Resistivity >10¹⁴ ohm-cm	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing	Part A: 55,000-110,000 cps, Part B: 100-1,000 cps	60-70 minutes at 176-212°F [80-100°C] or 20-30 minutes at 257°F [125°C]	80-90 Shore D	-60°F to +450°F	/es/tds/ep62-1htmed-black
EP62-1HTND Two component epoxy system featuring superior temperature and unsurpassed chemical resistance, especially to acids Glass Transition Temperature (Tg) 145-155°C Tensile Modulus 500,000-550,000 psi	RoHS Compliant	Bonding Sealing	Part A: paste, Part B:100-1,000 cps	60-70 minutes at 176-212°F [80-100°C] or 20-30 minutes at 257°F [125°C]. To obtain optimum properties, post curing at 212-302°F [100-150°C] for 3-5 hours is recommended	80-90 Shore D	-60°F to +450°F	/es/tds/ep62-1htnd
EP62-1LO High temperature resistant, NASA low outgassing epoxy compound Dielectric Constant 4.2 Volume Resistivity >10¹⁴ ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	4,000-8,000 cps	4-6 hours at 60-70°C, 20-40 minutes at 80-100°C or 10 minutes at 125°C	80-90 Shore D	-60°F to +450°F	/es/tds/ep62-1lo
EP62-1LPSP Two component, high performance epoxy system featuring convenient handling along with excellent temperature and chemical resistance Tensile Lap Shear Strength 1,800-2,000 psi Volume Resistivity >10¹⁴ ohm-cm	NASA Low Outgassing 1,000 Hours at 85°C/85% RH RoHS Compliant	Bonding Sealing Coating Encapsulation Impregnation Potting Underfill	150-300 cps	Typical cure conditions range from 8-10 hours at 60-70°C, 60-90 minutes at 80-100°C or 30-60 minutes at 125°C. Post curing at 100-150°C for 3-4 hours will help optimize properties.	75-85 Shore D	4K to +400°F	/es/tds/ep62-1lpsp

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