Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP93FRHT Two component epoxy system meets the Airbus standards noted below from ABD0031, Issue F, June 8, 2005 for flame retardancy Dielectric Constant 4.5 Volume Resistivity >10¹⁴ ohm-cm	Airbus Standards for Flame Retardancy RoHS Compliant	Bonding Sealing Encapsulation Potting Coating Casting Gap Filling	6,000-9,000 cps	overnight at 75°F followed by 3-5 hours at 150-200°F	80-90 Shore D	-80°F to +400°F	/es/tds/ep93frht
Super Gel 9 Two component urethane modified epoxy gel-like system Dielectric Strength >420 volts/mil Refractive Index 1.5253	RoHS Compliant	Bonding Sealing Casting Encapsulation Potting Coating Gap Filling	3,000-9,000 cps	cures at 75°F, 4-7 days	<5 Shore A	-100°F to +200°F	/es/tds/super-gel-9
Supreme 112 Two part epoxy for bonding, sealing, potting and impregnation requires elevated temperature curing Glass Transition Temperature (Tg) 190-195°C Volume Resistivity >10¹⁴ ohm-cm at 25°C, >10¹² ohm-cm at 150°C	NASA Low Outgassing RoHS Compliant	Bonding Sealing Impregnation Coating Encapsulation Gap Filling	50-200 cps	1-2 hours at 200-210°F followed by 3-4 hours at 250°F and then 4-6 hours at 300°F	75-90 Shore D	-80°F to +550°F	/es/tds/supreme-112
Supreme 11AOHT Two component thermally conductive, electrically insulative epoxy compound for bonding, coating and sealing Dielectric Constant 4.6 Tensile Lap Shear Strength 3,200-3,400 psi	MIL-STD-883J for Thermal Stability RoHS Compliant	Bonding Coating Sealing Gap Filling	Part A: 200,000-300,000 cps, Part B: paste	8-12 hours at 75°F, plus 1-2 hours at 150-200°F	80-85 Shore D	-112°F to +400°F	/es/tds/supreme-11aoht
Supreme 11AOHT-LO Toughened, high strength, two component epoxy for bonding and sealing Coefficient of Thermal Expansion 35-40 X 10⁻⁶ in/in/°C Tensile Lap Shear Strength 3,200-3,400 psi	1,000 Hours at 85°C/85% RH RoHS Compliant NASA Low Outgassing	Bonding Sealing Coating	Part A: 200,000-300,000 cps, Part B: paste	overnight at 75°F followed by a few hours at 150-200°F	80-90 Shore D	-112°F to +400°F	/es/tds/supreme-11aoht-lo
Supreme 11AOHTLP Two component, thermally conductive, electrically insulative epoxy for bonding, sealing and coating Dielectric Constant 4.6 Tensile Modulus 400,000-450,000 psi	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	overnight at 75°F followed by 3-4 hours at 150-200°F	85-90 Shore D	-112°F to +400°F	/es/tds/supreme-11aohtlp
Supreme 11AOHTMed Toughened, high strength, two component epoxy for bonding and sealing Dielectric Constant 4.6 T-peel Strength 15-20 pli	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 200,000-300,000 cps, Part B: paste	75°F: 24-36 hours; 200°F: 1-2 hours	80-90 Shore D	-112°F to +400°F	/es/tds/supreme-11aohtmed
Supreme 11HT Toughened, two component epoxy for bonding, sealing and coating Coefficient of Thermal Expansion 45-50 X 10⁻⁶ in/in/°C Tensile Lap Shear Strength 3,200-3,400 psi	RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 90,000-120,000 cps, Part B: 60,000-110,000 cps	overnight at 75°F, followed by 1 hour at 150-200°F	75-85 Shore D	-112°F to +400°F	/es/tds/supreme-11ht
Supreme 121AO Two part toughened epoxy for bonding, sealing and encapsulation features good thermal conductivity Glass Transition Temperature (Tg) 200-210°C Thermal Conductivity 4-5 BTU•in/(ft²•hr•°F)	NASA Low Outgassing RoHS Compliant	Bonding Sealing Encapsulation Potting Coating Gap Filling	10,000-25,000 cps	1-2 hours at 200-210°F followed by 3-4 hours at 250°F and then 4-6 hours at 300°F. Additional post curing at 350°F for 2-4 hours will further enhance product properties.	85-95 Shore D	-80°F to +550°F	/es/tds/supreme-121ao
Supreme 121AOMed Two part toughened epoxy for bonding, sealing and potting featuring good thermal conductivity and high temperature resistance; requires oven curing Glass Transition Temperature (Tg) 200-210°C Thermal Conductivity 4-5 BTU•in/(ft²•hr•°F) [0.58-0.72 W/(m•K)]	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing Encapsulation Potting Coating Gap Filling	10,000-25,000 cps	1-2 hours at 200-210°F followed by 3-4 hours at 250°F and then 4-6 hours at 300°F. Additional post curing at 350°F for 2-4 hours will further enhance product properties.	85-95 Shore D	-80°F to +550°F	/es/tds/supreme-121aomed

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