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Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP3HT One component epoxy system for bonding, sealing and coating Dielectric Constant 3.7 Tensile Lap Shear Strength 2,000-2,200 psi	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating	100,000-200,000 cps	250°F for 20-30 minutes, 300°F for 5-10 minutes	80-90 Shore D	-60°F to +400°F	/es/tds/ep3ht
EP3HTMed One part, heat curing, biocompatible epoxy compound Tensile Lap Shear Strength 1,600-1,800 psi Volume Resistivity >10¹⁴ ohm-cm	ISO 10993-5 for Cytotoxicity RoHS Compliant USP Class VI Medical	Bonding Sealing Coating	100,000-200,000 cps	250°F for 20-30 minutes, 300°F for 5-10 minutes, followed by 1 to 3 hours at +250 to +300°F	80-90 Shore D	-60°F to +400°F	/es/tds/ep3htmed
EP3HTND-2 Black One part, heat curing black epoxy compound with paste consistency Tensile Lap Shear Strength 1,600-1,800 psi Volume Resistivity >10¹⁴ ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	250°F for 20-30 minutes, 300°F for 5-10 minutes	80-90 Shore D	-60°F to +400°F	/es/tds/ep3htnd-2-black
EP3HTND-2Med Black One part, heat curing, biocompatible epoxy compound with paste consistency Tensile Lap Shear Strength 1,600-1,800 psi Volume Resistivity >10¹⁴ ohm-cm	ISO 10993-5 for Cytotoxicity RoHS Compliant USP Class VI Medical	Bonding Sealing Gap Filling	paste	250°F for 20-30 minutes, 300°F for 5-10 minutes	80-90 Shore D	-60°F to +400°F	/es/tds/ep3htnd-2med-black
EP3HTS One part, electrically conductive epoxy system Tensile Lap Shear Strength >400 psi Volume Resistivity <0.001 ohm-cm	RoHS Compliant	Bonding Sealing Gap Filling Coating	paste	45-90 minutes at 250°F or 20-40 minutes at 300°F	65 Shore D	-60°F to +400°F	/es/tds/ep3hts
EP3HTS-LO One part, high performance, electrically conductive epoxy, NASA low outgassing compliant Tensile Lap Shear Strength >400 psi Volume Resistivity <0.001 ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	Cures readily at 250°F at 45-50 minutes or in just 20-30 minutes at 300°F.	65-75 Shore D	-60°F to +400°F	/es/tds/ep3hts-lo
EP3HTSCN One part, high performance, electrically conductive epoxy Tensile Lap Shear Strength 900-1,100 psi Volume Resistivity 0.05 to 0.10 ohm-cm	RoHS Compliant	Coating Bonding Sealing Gap Filling	paste	cures readily at 250°F at 45-50 minutes or in just 20-30 minutes at 300°F	75-85 Shore D	-60°F to +400°F	/es/tds/ep3htscn
EP3HTSDA-2Med One component, medical grade, electrically conductive epoxy featuring exceptionally high thermal conductivity Thermal Conductivity 45-49 BTU•in/(ft²•hr•°F) W/(m•K)] Volume Resistivity <0.001 ohm-cm	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Die Attach Gap Filling Sealing Coating	>400,000 cps	250°F for 20-30 minutes, 300°F for 5-10 minutes	75-85 Shore D	-80°F to +450°F	/es/tds/ep3htsda-2med
EP3HTSMed One part, electrically conductive, biocompatible epoxy system Tensile Lap Shear Strength >400 psi Volume Resistivity <0.001 ohm-cm	USP Class VI Medical RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	40-90 minutes at 250°F or 20-40 minutes at 300°F (minimum cure temperature is 235-240°F)	60-80 Shore D	-60°F to +400°F	/es/tds/ep3htsmed
EP3RR-80 One component epoxy system for bonding, sealing, potting and encapsulation applications featuring curing temperatures of 175-180°F or higher Dielectric Constant 4.4 Volume Resistivity 10¹⁴ ohm-cm	MIL-STD-810G for Fungus Resistance NASA Low Outgassing 1,000 Hours at 85°C/85% RH RoHS Compliant	Sealing Encapsulation Potting Bonding	60,000-120,000 cps	Cure in 45-50 minutes at 175-180°F, or in 25-30 minutes 250°F	80-90 Shore D	-100°F to +350°F	/tds/ep3rr-80

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