Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
LED422DC90 One component, nanosilica filled dual curing LED system allowing for rapid fixturing and subsequent curing by heat. Complies with NASA low outgassing Refractive Index 1.49 Tensile Modulus 475,000-575,000 psi	RoHS Compliant NASA Low Outgassing	Bonding Sealing Coating Encapsulation Gap Filling	2,000-15,000 cps	exposure to LED light at 405 nm which induces polymerization in a cross sectional mode, 2-3 mm deep. The cure is then completed by adding heat at 90-95°C for 30-45 minutes.	85-90 Shore D	-80°F to +350°F	/es/tds/led422dc90
MasterSil 151 Two component, addition curing silicone for potting, encapsulation and sealing Dielectric Strength 450 volts/mil Refractive Index 1.436	RoHS Compliant 1,000 Hours at 85°C/85% RH	Sealing Encapsulation Potting Coating Gap Filling Bonding Casting	Part A: 2,000-4,000 cps, Part B: 50-150 cps	75°F 24-48 hours; 200°F 1-2 hours	50-60 Shore A	-65°F to +400°F	/es/tds/mastersil-151
MasterSil 151Med Black Two component, biocompatible silicone compound for bonding, potting and encapsulation Dielectric Strength 450 volts/mil Volume Resistivity 10¹⁴ ohm-cm	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Encapsulation Potting Coating Sealing Gap Filling Casting	Part A: 2,000-4,000 cps, Part B: 50-150 cps	75°F: 24-48 hours; 200°F: 1-2 hours	40-50 Shore A	-65°F to +400°F	/es/tds/mastersil-151med-black
MasterSil 151S Two part, silver filled, low outgassing silicone for bonding, sealing and coating Elongation 100-150% Volume Resistivity 0.004 ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: paste, Part B: 50-150 cps	4-6 hours at 150 to 180°F and 2-3 hours at 190 to 210°F	80-90 Shore A	-80°F to +400°F	/es/tds/mastersil-151s
MasterSil 151TC Two part, room temperature curing, thermally conductive silicone with ultra fine particle filler for bonding and smaller gap filling Dielectric Strength 450 volts/mil Thermal Conductivity 4.0-5.8 BTU•in/(ft²•hr•°F)	NASA Low Outgassing RoHS Compliant	Bonding Gap Filling Sealing Coating Casting Potting Encapsulation	30,000-60,000 cps	Optimum cure is overnight at 75°F followed by 1-2 hours at 150-200°F.	80-90 Shore A	-65°F to +400°F	/es/tds/mastersil-151tc
MasterSil 153AOMed Two part medical grade, thermally conductive, electrically insulating silicone for bonding and sealing Dielectric Strength 450 volts/mil Elongation 100-120%	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 200,000-550,000 cps, Part B: 100,000-500,000 cps	overnight at 75°F followed by 2-4 hours at 135°F to 185°F	65-75 Shore A	-65°F to +400°F	/es/tds/mastersil-153aomed
MasterSil 153Med Two component, addition cured medical grade silicone for bonding and sealing Dielectric Strength 450 volts/mil Elongation 400-500%	ISO 10993-5 for Cytotoxicity RoHS Compliant USP Class VI Medical	Bonding Sealing Coating Gap Filling	Part A: 150,000-300,000 cps, Part B: 50,000-250,000 cps	75°F: 48-72 hours	20-35 Shore A	-65°F to +400°F	/es/tds/mastersil-153med
MasterSil 153Med Black Two component, paste consistency, addition cured medical grade silicone for bonding and sealing Dielectric Strength 450 volts/mil Elongation 400-500%	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 150,000-300,000 cps, Part B: 50,000-250,000 cps	75°F: 48-72 hours; 200°F: 2-3 hours; Optimum cure: Overnight at 75°F followed by 1 hour at 150-200°F	20-35 Shore A	-65°F to +400°F	/es/tds/mastersil-153med-black
MasterSil 155 Two part, graphite filled silicone for high performance bonding, sealing and coating Elongation 300-400% Volume Resistivity 20-40 ohm-cm	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	75°F: 6-7 days; 150°F: 2-4 hours; Optimum cure schedule: overnight at 75°F followed by 2-4 hours at 150°F	35-45 Shore A	-85°F to +400°F	/es/tds/mastersil-155
MasterSil 157 Two component, addition curing silicone for potting, encapsulation and sealing Dielectric Strength 450 volts/mil Refractive Index 1.43	RoHS Compliant	Bonding Sealing Encapsulation Potting Coating Gap Filling	Part A: 5,500-6,000 cps, Part B: 100-300 cps	12-24 hours at 75°F, followed by 3-5 hours at 150-200°F	35-45 Shore A	-175°F to +500°F	/es/tds/mastersil-157

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