EP4TC-80

Master Bond EP4TC-80 is a one component, paste epoxy for bonding, sealing and small encapsulation applications. Its main attributes are thermal conductivity and electrical insulation by utilizing an ultra fine filler material. The system has outstanding physical strength properties, stellar dimensional stability and low shrinkage upon curing. It is not premixed and frozen and has an unlimited working life at room temperature. After using, it should be returned to the refrigerator.

EP4TC-80 bonds well to a wide variety of substrates such as metals, composites, ceramics and many plastics. It has particularly noteworthy tensile modulus and compressive strength. Because the filler material has ultra fine particles, with the largest being 10-15 microns, it can be applied in very thin sections. The combination of fine bond lines and thermal conductivity lowers the thermal resistance to 10-20 x 10-6 K•m2/W. Curing is simple and straightforward, 80°C for 90-120 minutes with an optional post cure of 1-2 hours at 80°C to optimize properties.

EP4TC-80 will resist water, oils and fuels. Its color is gray. The service temperature range is -50°C to +175°C. It is an attractive option in electronic, aerospace, opto-electronic, and specialty OEM applications where thermal management is an essential consideration. Some examples include heat sink bonding, encapsulating, and bonding chips to lead-frames. In opto-electronics, EP4TC-80 may also be used for sealing ferrules and fiber optic feed-throughs.

Product Advantages

• Single component, no mixing needed
• Unlimited working life
• Very high modulus
• Low thermally resistant adhesive
• Suitable for bonding and small encapsulations