Other Certifications

Master Bond EP21ARHTND-2 is a two part epoxy adhesive, designed to withstand prolonged exposure to a wide range of chemicals. “The system’s chemical resistance was successfully tested in chemicals such as 98% sulfuric acid, 25% hydrochloric acid, 20% phosphoric acid, and 15% nitric acid, by soaking cured samples for more than 12 months”, says Senior Product Engineer Rohit Ramnath. “The product also passes the damp heat reliability testing by withstanding 1000 hours of 85°C and 85% Relative Humidity (RH).” Although EP21ARHTND-2 is capable of curing at room temperature, to optimize its acid resistance properties, a cure schedule of overnight at ambient temperatures, followed by a heat cure of 150-200°F for 2-4 hours or longer is typically recommended. It is a reliable electrical insulator with a volume resistivity greater than 1014 ohm-cm at 75°F, and dielectric strength of 440 volts/mil at 75°F for a 1/8-inch test specimen. Other noteworthy properties include a tensile strength of 9,000-10,000 psi, and a Shore D hardness of 75-85. The adhesive provides good heat resistance and is serviceable from -60°F to +400°F. EP21ARHTND-2 does not contain solvents and is RoHS compliant. The product bonds well to metals, ceramics, composites, rubbers and plastics. It features a smooth paste-like consistency and will not flow, or sag once applied, making it ideal for bonding and sealing applications. It is available for use in ½ pint, pint, quart and gallon container kits. Specialty packaging can also be provided in 50 ml (cc) double barrel cartridges, which not only eliminates the need for manual measuring as well as mixing, but also enables the possibility of manual or automated dispensing.

Developed for chip-on-board encapsulation applications, Master Bond Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system that can be used for dam-and-fill. This video demonstrates the process of dispensing the epoxy paste and creating a barrier, or “dam”, which can then be filled by a flowable encapsulant. This thermally conductive compound also meets NASA low outgassing specifications and can withstand 1,000 hours at 85°C/85% RH.

Non-drip epoxy paste, black in color, has outstanding temperature and chemical resistance. Superior toughness and thermal cycling capability. Meets low outgassing specifications. Withstands 1,000 hours 85°C/85% RH. Superb electrical insulator. Service temperature range -80°F to +450°F.

Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. Independent tests demonstrate that this epoxy’s abrasion resistance value is significantly higher than that of a typical epoxy composition. EP30NS is also optically clear and meets NASA low outgassing specifications. Click now to learn more about EP30NS.

High flexibility and toughness. Outstanding abrasion resistance. Moderate viscosity. Resists thermal cycling and mechanical shocks. Bonds well to glass, metals, ceramics, composites and many plastics including polycarbonates, acrylics. Serviceable from -80°F to +250°F.