News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	Toughened, Two Component Epoxy Features Enhanced Dimensional Stability and a Long Working Life Release Date: 10/09/2017 Product: EP110F8-5 Developed for potting, sealing, encapsulation and casting applications, Master Bond EP110F8-5 is dimensionally stable and has low shrinkage upon cure. This system features superior electrical insulation properties including a volume resistivity exceeding 10¹⁵ ohm-cm, a dielectric constant of 2.91 at 1 KHz and a… Read More...
	One Component, High Temperature Resistant Epoxy Offers a Low Coefficient of Thermal Expansion Release Date: 09/18/2017 Product: EP13LTE Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10^-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications. “EP13LTE is very convenient to use, since it doesn’t require mixing, and has an unlimited working life at room temperature,” said Venkat Nandivada, manager of… Read More...
	High Temperature Resistant, NASA Low Outgassing Approved Epoxy for Die Attach Applications Release Date: 08/28/2017 Product: EP17HTDA-1 Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for bonding and sealing. “EP17HTDA-1 has the ideal viscosity and flow for die attach applications,” said Rohit Ramnath, senior product engineer. “It has a high glass transition temperature (T_g) and also… Read More...
	One Component Elastomeric Primer/Adhesive System Meets ISO 10993-5 Specifications Release Date: 08/07/2017 Product: X21Med Developed for priming and bonding polyolefinic substrates, Master Bond X21Med is a single component elastomeric compound that passes ISO 10993-5 tests for cytotoxicity. “This specialty system was designed to be used as a primer that would promote adhesion between polyolefins and other surfaces such as metals, ceramics,… Read More...
	Thermally Conductive, Electrically Insulative Epoxy Delivers Low Exotherm for Large Castings and Potting Applications Release Date: 07/17/2017 Product: EP39MAOHT Master Bond EP39MAOHT is a room temperature curing system for demanding bonding, sealing, coating, potting and encapsulation applications. “It is a versatile product that combines convenient handing, good flow, thermal conductivity, electrical insulation and high temperature resistance,” said Robert Michaels, vice president… Read More...