Electrical Properties of Adhesive Systems

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. Browse our catalog to find out more.

Adhesive compounds are uniquely qualified to meet the challenging requirements of assembling die, package, and other components into products able to cope with higher heat loads. Learn why adhesives with ultra low thermal resistance are the preferred bonding compounds for electronic applications requiring superior thermal management.

Get an up close look at how the dam and fill process works to protect electronic components on a circuit board. This two step method utilizes a damming compound such as Supreme 3HTND-2DM-1 to create a barrier around the component, while the flowable filler material, EP3UF-1, covers the component for protection.

An adhesive utilized for hermetically sealing batteries must fulfill several criteria, including resistance to chemicals, temperature, pressure, and electricity. It should exhibit minimal outgassing, low moisture permeability, high adhesion to packaging materials, and suitable modulus and thermal expansion properties. This adhesive must not contaminate the battery's electrolyte, either during curing or through chemical degradation over the battery's lifespan. The adhesive's rheological properties, such as wetting and adhesion, are crucial for ensuring a continuous, impermeable seal. Additionally, the adhesive must maintain its integrity over a wide temperature range, necessitating strong adhesion to the battery casing, defect-free application, and a coefficient of thermal expansion compatible with temperature variations during battery operation. Learn more about the requirements, applications and challenges involving the adhesive specifications for the hermetic sealing of microbatteries in this white paper.

With its thin bond line thickness and low viscosity, EP4EN-80 is ideal for bonding, encapsulating and potting applications. Watch a real-life demonstration of how this epoxy compound can be used while observing its flowability and ease of use.

Dielectric constant, dissipation factor, dielectric strength, surface and volume resistivity are all fundamental electrical properties of epoxies. How they are measured, what values are desirable and how they react to changes in temperature, fillers and other variables are considered in this paper. The specific composition of resin and curing agents will also affect the electrical properties of a cured epoxy system. Three major types of curing agents are explained in this paper along with their benefits and trade-offs with respect to electrical properties.