Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP36AN One component, B-stage epoxy for potting, encapsulation, coating and bonding Coefficient of Thermal Expansion 75-85 in/in X 10⁻⁶/°C Dielectric Strength 440 volts/mil	MIL-STD-810G for Fungus Resistance RoHS Compliant	Bonding Coating Encapsulation Potting	90,000-130,000 cps	350°F for 2-3 hours	80 Shore D	-100°F to +500°F	/fr/tds/ep36an
EP36AO One component, B-staged epoxy for potting, encapsulation, coating and bonding Dielectric Strength 440 volts/mil Glass Transition Temperature (Tg) 95-100°F [35-37.8°C]	NASA Low Outgassing RoHS Compliant	Bonding Coating Encapsulation Potting Gap Filling	80,000-120,000 cps	liquefy at 200°F, cure at 350°F for 2-3 hours	80 Shore D	-100°F to +500°F	/fr/tds/ep36ao
EP36CLV One component, B-staged epoxy for potting, sealing, coating and bonding Dielectric Strength 440 volts/mil Glass Transition Temperature (Tg) 93°F [34°C]	RoHS Compliant	Bonding Sealing Coating Potting Encapsulation Gap Filling	6,000-25,000 cps	2-3 hours at 350°F after liquefying at 200°F for about 30 minutes	70-75 Shore D	-100°F to +500°F	/fr/tds/ep36clv
EP36FR One component, B-staged epoxy for potting, encapsulation, coating and bonding; meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy Dielectric Constant 4.7 Dielectric Strength 440 volts/mil	RoHS Compliant FAR 25.853(a) for Flame Retardancy Airbus Standards for Flame Retardancy	Bonding Sealing Coating Encapsulation Potting Gap Filling	80,000-120,000 cps	liquefy at minimum 200°F then cure at 350°F, hours: 2-3 hours	80 Shore D	-100°F to +500°F	/fr/tds/ep36fr
EP3HT One component epoxy system for bonding, sealing and coating Dielectric Constant 3.7 Tensile Lap Shear Strength 2,000-2,200 psi	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating	100,000-200,000 cps	250°F for 20-30 minutes, 300°F for 5-10 minutes	80-90 Shore D	-60°F to +400°F	/fr/tds/ep3ht
EP3HTMed One part, heat curing, biocompatible epoxy compound Tensile Lap Shear Strength 1,600-1,800 psi Volume Resistivity >10¹⁴ ohm-cm	ISO 10993-5 for Cytotoxicity RoHS Compliant USP Class VI Medical	Bonding Sealing Coating	100,000-200,000 cps	250°F for 20-30 minutes, 300°F for 5-10 minutes, followed by 1 to 3 hours at +250 to +300°F	80-90 Shore D	-60°F to +400°F	/fr/tds/ep3htmed
EP3HTND-2 Black One part, heat curing black epoxy compound with paste consistency Tensile Lap Shear Strength 1,600-1,800 psi Volume Resistivity >10¹⁴ ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	250°F for 20-30 minutes, 300°F for 5-10 minutes	80-90 Shore D	-60°F to +400°F	/fr/tds/ep3htnd-2-black
EP3HTND-2Med Black One part, heat curing, biocompatible epoxy compound with paste consistency Tensile Lap Shear Strength 1,600-1,800 psi Volume Resistivity >10¹⁴ ohm-cm	ISO 10993-5 for Cytotoxicity RoHS Compliant USP Class VI Medical	Bonding Sealing Gap Filling	paste	250°F for 20-30 minutes, 300°F for 5-10 minutes	80-90 Shore D	-60°F to +400°F	/fr/tds/ep3htnd-2med-black
EP3HTS One part, electrically conductive epoxy system Tensile Lap Shear Strength >400 psi Volume Resistivity <0.001 ohm-cm	RoHS Compliant	Bonding Sealing Gap Filling Coating	paste	45-90 minutes at 250°F or 20-40 minutes at 300°F	65 Shore D	-60°F to +400°F	/fr/tds/ep3hts
EP3HTS-LO One part, high performance, electrically conductive epoxy, NASA low outgassing compliant Tensile Lap Shear Strength >400 psi Volume Resistivity <0.001 ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	Cures readily at 250°F at 45-50 minutes or in just 20-30 minutes at 300°F.	65-75 Shore D	-60°F to +400°F	/fr/tds/ep3hts-lo

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