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Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP46HT-2 Two part high performance epoxy for bonding, sealing, coating and casting Dielectric Strength 450 volts/mil Glass Transition Temperature (Tg) 155-165°C	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Casting	12,000-20,000 cps	250-300°F, 3-4 hours	80-90 Shore D	-100°F to +500°F	/fr/tds/ep46ht-2
EP46HT-2AO Black Two part high performance epoxy for bonding, sealing and encapsulation Dielectric Strength 450 volts/mil Volume Resistivity >10¹⁴ ohm-cm	MIL-STD-810G for Fungus Resistance NASA Low Outgassing RoHS Compliant	Bonding Sealing Encapsulation Coating Casting Potting Gap Filling	140,000-280,000 cps	3-4 hours at 250-300°F followed by a post cure of 2-3 hours at 350-400°F	85-90 Shore D	-100°F to +500°F	/fr/tds/ep46ht-2ao-black
EP46HT-2Med Two component, heat resistant, medical grade epoxy Dielectric Strength 450 volts/mil Tensile Strength 10,000-11,000 psi	USP Class VI Medical RoHS Compliant	Bonding Sealing Coating Potting Encapsulation Gap Filling	12,000-20,000 cps	250-300°F for 3-4 hours, followed by 350-400°F for 2-3 hours	80-90 Shore D	-100°F to +500°F	/fr/tds/ep46ht-2med
EP46HT-2ND2 Two part, non-drip epoxy for bonding, sealing, coating and casting Glass Transition Temperature (Tg) 155-165°C Tensile Modulus 400,000-450,000 psi	RoHS Compliant	Bonding Sealing Coating	paste	250-300°F: 3-4 hours; post cure, 350-400°F: 2-3 hours	80-90 Shore D	-100°F to +500°F	/fr/tds/ep46ht-2nd2
EP48TC Two part epoxy adhesive with ultra low thermal resistance properties meets NASA low outgassing requirements Coefficient of Thermal Expansion 13-15 X 10⁻⁶ in/in/°C Dielectric Constant 4.7 Volume Resistivity >10¹⁴ ohm-cm	NASA Low Outgassing 1,000 Hours at 85°C/85% RH RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	overnight at 75°F followed by 3-5 hours at 150-200°F	85-95 Shore D	-100°F to +300°F	/fr/tds/ep48tc
EP50-1.5 Two component, ultra fast setting epoxy system for bonding and sealing Tensile Modulus >350,000 psi Volume Resistivity 10¹⁴ ohm-cm	RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 10,000-16,000 cps, Part B: 50,000-75,000 cps	75°F 6-12 hours	>70 Shore D	4K to +250°F	/fr/tds/ep50-15
EP51 Fast setting, two component epoxy for bonding and sealing Dielectric Constant 4.5 Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 10,000-16,000 cps, Part B: 50,000-75,000 cps	75°F: 12-18 hours; 150°F: 30-60 minutes	>70 Shore D	4K to +250°F	/fr/tds/ep51
EP51AO Two component, epoxy adhesive, sealant and coating compound Coefficient of Thermal Expansion 25-30 x 10⁻⁶ in/in/°C Dielectric Strength >400 volts/mil	RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 50,000-100,000 cps, Part B: 75,000-125,000 cps	75°F: 12-24 hours, 200°F: 1 hour	>75 Shore D	4K to +250°F	/fr/tds/ep51ao
EP53TC Two part epoxy with high thermal conductivity, electrically insulating, and low thermal resistance for bonding, sealing, coating, and potting Acoustical Impedance 8.5 MRayl Thermal Conductivity 16-18 BTU•in/(ft²•hr•°F) [2.31-2.60 W/(m•K)]	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Encapsulation Potting Gap Filling	45,000-65,000 cps	Cures at 80°C for 2 hours followed by 2-4 hours at 90-125°C.	85-95 Shore D	-100°F to +300°F	/fr/tds/ep53tc
EP54TC Two part epoxy with high thermal conductivity, electrically insulating, and low thermal resistance for bonding and sealing Dielectric Constant 4.7 Thermal Conductivity 41.6-45.1 BTU•in/(ft²•hr•°F) [6.0-6.5 W/(m•K)]	RoHS Compliant NASA Low Outgassing	Bonding Sealing Coating Gap Filling	100,000-200,000 cps	80°C for 2 hours followed by 2-4 hours at 90-125°C. An alternative cure schedule would be 4-6 hours at 80-90°C.	85-95 Shore D	-100°F to +400°F	/fr/tds/ep54tc

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