Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
MasterSil 970-LO Two part, low outgassing addition curing silicone for bonding, potting, sealing & coating Dielectric Constant 2.8 Elongation 200-250%	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	Part A: 11,000-16,000 cps, Part B: 8,000 - 12,000 cps	4-6 hours at 150°F or 2-3 hours at 180-200°F	25-40 Shore A	-120°F to +400°F	/fr/tds/mastersil-970-lo
MasterSil 971-LO Two part, low outgassing addition curing silicone for bonding, potting, sealing & coating Tensile Lap Shear Strength 400-800 psi Tensile Modulus 400-600 psi	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	Part A: 5,000-10,000 cps, Part B: 4,000-8,000 cps	20-40 minutes at 250-300°F or 1-2 hours at 160-200°F		-120°F to +400°F	/fr/tds/mastersil-971-lo
MasterSil 972TC-LO Two part, thermally conductive, low outgassing silicone for bonding, potting, coating & sealing Dielectric Strength 450 volts/mil Elongation 40-80%	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	30,000-60,000 cps	20-40 minutes at 250-300°F or 1-2 hours at 160-200°F	60-70 Shore A	-120°F to +400°F	/fr/tds/mastersil-972tc-lo
MasterSil 973S-LO Two part, electrically conductive, low outgassing silicone for bonding, sealing and coating Elongation 50-100% Volume Resistivity 0.004 ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	25-45 minutes at 250-300°F or 1-2 hours at 160-200°F	80-90 Shore A	-120°F to +400°F	/fr/tds/mastersil-973s-lo
MasterSil 980 Two part, fluorosilicone for high performance bonding, sealing, coating and potting Dielectric Constant 6.4 Elongation 100-200%	RoHS Compliant	Bonding Sealing Coating Encapsulation	moderate flow	30-60 minutes at 260-300°F or 75-90 minutes at 200-250°F	20-30 Shore A	-85°F to +465°F	/fr/tds/mastersil-980
MasterSil 981-LO Two component silicone for bonding and sealing meets NASA low outgassing specifications Coefficient of Thermal Expansion 450-500 x 10⁻⁶ in/in/°C Refractive Index 1.437	RoHS Compliant NASA Low Outgassing	Bonding Sealing	12,500-17,500 cps	Cures at ambient temperature in 48–72 hours, or more rapidly in 2–4 hours at 135–165°F. For optimal performance, an initial overnight cure at room temperature followed by 2–4 hours at 135–165°F is recommended.	20-30 Shore A	-65°F to +400°F	/fr/tds/mastersil-981-lo

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