Smart Medical Devices | MasterBond.com

Master Bond adhesive systems are used for the assembly of smart medical devices

High performance Master Bond adhesive systems are utilized for the assembly of smart medical devices. These epoxy, silicone, cyanoacrylate, and UV/visible light curing systems are desirable for bonding dissimilar substrates ranging from metals, plastics, ceramics, glass, and composites.

Different Master Bond grades are frequently employed for adhering stainless steel, titanium, aluminum, silicone rubber, alumina, zirconia, polycarbonate, PEEK, PEI, silicon, ABS etc. for construction of these devices. These adhesive products feature the following vitally important characteristics:

meet biocompatibility standards such as USP Class VI requirements and ISO 10993-5 for cytotoxicity
robust strength
seal and protect devices from moisture, body fluids, common disinfectants, contaminants etc.
distinguished for reducing the weight and size of medical devices
withstands various sterilization methods including autoclaving, ethylene oxide, gamma radiation, hydrogen peroxide, peracetic acid etc.
grades can be cured by heat, UV / visible light, moisture or at room temperature
thermal/electrical conductivity or electrical insulation properties
opaque or transparent
thermal stability
even stress distribution
compatibility with automated dispensers

Master Bond has been at the forefront in developing technologically advanced bonding, sealing, coating and potting compounds for smart medical devices. Working in collaboration with our customers has enabled Master Bond to utilize our expertise to contribute solutions for complex requirements. As this ever-growing market is expanding expeditiously, our meticulous efforts will give our customers a competitive edge.

Master Bond products are capable of being utilized in smart medical devices such as:

pulse oximeter
blood pressure monitors
blood glucose monitors
heart rate monitors
fitness trackers
biosensors
smart thermometers
hearing aids
smart bed
smart pill technology
smart inhalers and medical devices for respiratory care
telehealth platforms
smart watches
wearable devices
smart clothing
glucometer
posture correctors
sleep trackers

Key end-use markets for transformative devices are:

hospitals and clinics
rehabilitation and long-term care facilities
homes
ambulances
scientific research facilities
telemedicine and remote healthcare

Advantages of smart medical devices:

improved diagnosis, treatment, patient monitoring
increased patient engagement
real time health data tracking
error reduction
more efficiency in healthcare system
remote care delivery
preemptive detection of health changes
time saving
medication plan adherence
promotes patient lifestyle modification
more informed decision making
adjusting treatment to compensate for patient’s condition
reduce hospitalizations
better care

Some examples of significant applications for adhesives in smart medical devices:

attachment of sensors to fitness trackers or smart watches
dielectric resins for encapsulation and sealing selective electronic components from moisture, dust, water ingress to maintain device reliability
flex circuit bonding to other components
antenna integration to insure optimal signal transmission and reception
display bonding with adhesives that possess high strength and optical clarity
bonding batteries to smart medical devices to prevent unwanted movement or detachment
adhesives bonding reservoirs, needles to assure leak-free connections for dry delivery devices
thermal interface material for bonding heat pipes, heat sinks to electronic components for effective heat dissipation to prevent overheating
bonding agents capable of high temperature exposure without degrading
electrically conductive adhesives for grounding, EMI shielding, bonding electronic components to PCBs and for sensor integration
biocompatible polymeric compounds for adhering tubing, connectors in catheters
joining sensors, microcontrollers to textile substrates for e-textiles component bonding

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Latest Developments

Case Study

EP114: Utilized to produce nanocomposites via vacuum infiltration

Master Bond EP114 is a two-component nano silica filled epoxy system which offers excellent dimensional stability and a very high glass transition temperature (Tg >200°C upon curing. Its ultra-low initial mixed viscosity (500–1500 cps at room temperature) can be further reduced by preheating to a slightly higher temperature, making EP114 ideal for vacuum infiltration to produce dense nanocomposites, as shown in the case study below.

EP42HT-2ND-2Med Black Two Part Epoxy System

Technical Data Sheet Excerpt

EP42HT-2ND-2Med Black Product Information

Two component epoxy paste adhesive. Resists sterilization exposure. USP Class VI approved. Outstanding thermal stability and electrical insulation properties. Cures at ambient temperatures. Withstands multiple cycles of autoclaving, radiation, EtO and chemical sterilants. Post curing is recommended to optimize physical properties. Serviceable from -60°F to +450°F.

White Paper

Epoxy Compounds Get Even Tougher

With adhesive products, high performance and rigidity are often thought to go hand in hand. And it is true that the very best strength, thermal, chemical and electrical properties tend to be found in rigid compounds, especially epoxies. Yet there is a growing class of adhesives, sealants and coatings that add ductility to the long list of desirable epoxy properties. Master Bond’s white paper examines the use of these toughened epoxies.

White Paper

Spotlight on Silicones

Silicone adhesive systems have several important performance characteristics that distinguish them from other adhesive families. Learn more about their unique combination of flexibility, high temperature resistance, and more specialized engineering properties.

White Paper

Electrically Conductive Adhesives Make Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.

Technical Data Sheet Excerpt

EP37-3FLF Product Information

Highly flexible, low viscosity, optically clear adhesive. Resistant to severe thermal cycling and thermal shock. Bonds well to dissimilar substrates. Low exotherm system. Long working life. Superior electrical insulation properties. Service temperature range from 4K to +250°F. One to one mix ratio by weight or volume.

Lab Report

Testing Adhesives for Resistance to Xylene

Many Master Bond epoxy systems are formulated with superior chemical resistance. In the lab, we continually test our materials by exposing them to specific chemicals over a long period of time. A common way of testing the chemical compatibility of an epoxy is immersing a sample in a chemical and measuring its change in weight over time. A significant loss or gain in weight would indicate a decreased ability of a material to stand up to chemical exposure. These tests allow us to more accurately recommend the right adhesive based on specific application requirements.In this experiment, we focused on testing our epoxies for their resistance to xylene. The compounds Master Bond used for testing are a variety of two component epoxies and one component UV curing systems with good overall chemical resistance. For the first round of testing the products tested were EP41S-5LV, EP42HT-2AO-1, EP46HT-2AO Black, UV16, UV22DC80-1, and UV26. For the second round of testing the products tested were EP125, EP42HT-2 and UV25. For the final round the products tested were EP41S-5, EP41S-1HT, EP62-1HT and EP62-1. These were compared against the resistance of a generic or standard non-chemically resistant epoxy. A few thin castings, roughly 2 inches in diameter and around 0.125 inches thick, were made for each product and cured in accordance to their specifications. Once the cured samples were created and initial weight was recorded, we submerged them in xylene. Then we continued recording weekly weight measurements. We carried on these tests with frequent weight recording for varying lengths of time based on the products performance. Below you will see the results for soaking results for around 10 months in the first batch, 2 years for the next batch, and greater than 2.5 years for the third batch of products. The castings were weighed periodically and the graphs shown below demonstrate the percentage of weight change over time.For the purpose of comparison, please notice that for each testing timeframe, a casting of a standard epoxy was also tested under these same conditions which served as a reference. As can be seen in the graphs, the standard epoxy was not as resistant to xylene as the other epoxies tested. It demonstrated a significantly greater change in weight over time, and the casting ultimately dissolved in xylene after 15 weeks.In general, a swelling of less than 4-5% can be considered excellent, especially since this test may be more rigorous compared to actual service conditions. It is also worth noting that in the context of a bonded joint or a potted assembly the exposure to xylene might not be as severe or direct as in the above test conditions.Please note, when choosing an epoxy for an application where the resistance to xylene is critical, many other factors must be considered in addition to the chemical resistance. Each of the epoxies in the charts above offers a distinct set of performance properties. For example, if thermal conductivity and high temperature resistance are needed, EP46HT-2AO Black may be a good option. If a fast cure is required and there is full access to a light source with no shadows, UV26 can be considered. For longer term exposure to xylene over several months to a year or longer, the likes of UV25, EP125 EP41S-5, and EP62-1 are excellent candidates. They all need to be processed or cured differently and although some of them can be cured at room temperature alone, for enhancing/optimizing chemical resistance especially to xylene, it is critical to add heat.Disclaimer: The findings in this article are not meant to be used for specification purposes.

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