Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP110F8-1 Two component, high performance epoxy for potting, sealing, encapsulating and casting Dielectric Constant 2.81 Elongation 85-95%	RoHS Compliant	Potting Sealing Encapsulation Casting Bonding Coating Gap Filling	2,500-5,000 cps	4-6 hours at 250-300°F	65-75 Shore D	-80°F to +325°F	/it/tds/ep110f8-1
EP110F8-3 Two component, high performance epoxy for potting, sealing, encapsulating and casting Elongation 120-150% Volume Resistivity >10¹⁵ ohm-cm	RoHS Compliant	Sealing Casting Encapsulation Potting Coating Bonding Gap Filling	1,000-2,000 cps	4-6 hours at 250-300°F	40-50 Shore A	-100°F to +300°F	/it/tds/ep110f8-3
EP110F8-5 Two component, high performance epoxy for potting, sealing, encapsulating and casting Coefficient of Thermal Expansion 60-70 in/in X 10⁻⁶/°C Tensile Modulus 35,000-65,000 psi	NASA Low Outgassing RoHS Compliant	Potting Sealing Encapsulation Coating Bonding Gap Filling	7,000-11,000 cps	4-6 hours at 250-300°F	70-80 Shore D	-100°F to +300°F	/it/tds/ep110f8-5
EP112 Two part, heat curing epoxy for potting, encapsulation, coating, sealing and impregnation Refractive Index 1.55 Volume Resistivity >10¹⁴ ohm-cm	1,000 Hours at 85°C/85% RH RoHS Compliant	Bonding Sealing Coating Encapsulation Impregnation Gap Filling	50-200 cps	1-2 hours at 200-210°F followed by 3-4 hours at 250°F and then 4-6 hours at 300°F	75-90 Shore D	-60°F to +450°F	/it/tds/ep112
EP121CL-LO Two component epoxy for potting, encapsulation, coating and sealing applications Dielectric Constant 3.25 Refractive Index 1.56	NASA Low Outgassing RoHS Compliant 1,000 Hours at 85°C/85% RH	Potting Encapsulation Sealing Coating Bonding	1,000-3,000 cps	2-3 hours at 250°F followed by 5-8 hours at 300°F with a 2 hour or longer post cure at 350°F	80-90 Shore D	-80°F to +500°F	/it/tds/ep121cl-lo
EP125 Two part epoxy for bonding and sealing featuring very high temperature resistance Dielectric Constant 3.9 Tensile Lap Shear Strength 2,500-2,700 psi	NASA Low Outgassing RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Gap Filling	250,000-500,000 cps	3-4 hours at 300°F or 2-3 hours at 350°F	85-95 Shore D	-80°F to +600°F	/it/tds/ep125
EP126 Two part epoxy for bonding and sealing featuring very high temperature resistance Dissipation Factor 0.091 @ 75F; 0.034 @ 500F Glass Transition Temperature (Tg) 160 to 180°C	RoHS Compliant	Bonding Sealing Coating Gap Filling	250,000-500,000 cps	3-4 hours at 300°F or 2-3 hours at 350°F		-80°F to +600°F	/it/tds/ep126
EP126TK Two part non-drip epoxy for bonding and sealing featuring very high temperature resistance Dielectric Constant 3.9 Glass Transition Temperature (Tg) 160 to 180°C	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	3-4 hours at 300°F or 2-3 hours at 350°F; post curing for 12-24 hours at 400-450°F		-80°F to +600°F	/it/tds/ep126tk
EP21 Two component, room temperature curing epoxy compound Dielectric Constant 2.9 Tensile Lap Shear Strength 2,800-3,000 psi	RoHS Compliant	Bonding Sealing Coating Encapsulation	Part A: 28,000-42,000 cps, Part B: 45,000-65,000 cps	75°F: 48-72 hours; 200°F: 2-3 hours; Optimum cure schedule: overnight at 75°F, plus 2-3 hours at 150-200°F	70-80 Shore D	-60°F to +250°F	/it/tds/ep21
EP21AC Two component epoxy system for encapsulating and coating that passes UL746A high amp arc ignition at 3.0 mm thickness with a PLC of 0 Dielectric Constant 2.89 at 9.375 GHz Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant UL 94HB for Flame Retardancy UL 746A for High Amp Arc Ignition Resistance	Bonding Sealing Coating Casting Encapsulation Potting	30,000-50,000 cps	75°F: 48-72 hours; 150-175°F: 2-3 hours; Optimal cure: Overnight at 75°F followed by 4-6 hours at 135-165°F	75-85 Shore D	-75°F to +194°F	/it/tds/ep21ac

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