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Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a new single component epoxy initially designed for glob top and chip coating applications. However, this system can also be utilized for encapsulation and bonding. Supreme 3CCM-85 cures within 2-3 hours at 175-185°F [80-85°C], which is advantageous for use on heat sensitive components and substrates.
Supreme 3CCM-85 is a toughened adhesive system, that bonds well to a variety of similar and dissimilar substrates. It has a high volume resistivity of more than 1014 ohm-cm and a thermal conductivity of 5-10 BTU•in/ft2•hr•°F [0.72-1.44 W/(m•K)]. The system is serviceable from -100°F to +350°F [-73°C to +177°C].
Since Supreme 3CCM-85 is not premixed and frozen and has a very long open time at room temperature, it is more convenient to handle and store than typical two component glob top systems. This opaque black compound has a thixotropic paste-like consistency and is easy to apply either manually or with an automated dispenser. Master Bond Supreme 3CCM-85 is available for use in common size syringes ranging from 10 cc to 30 cc as well as in standard size containers.
Master Bond Supreme 3CCM-85 is a multifunctional system for glob top, encapsulation and bonding applications featuring high thermal conductivity, electrical insulation and toughness. Read more about Master Bond’s adhesive systems for the electronic industry at https://www.masterbond.com/industries/adhesives-assembly-electronic-devices or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: firstname.lastname@example.org.
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James Brenner, Marketing Manager
MASTER BOND INC.
154 Hobart Street
Hackensack, NJ 07601-3922
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