One component, toughened epoxy system for bonding, sealing, coating and encapsulating

Key Features

  • No mixing, convenient handling
  • Cures at 175-185°F
  • Very good electrical insulation properties
  • Well suited for glob top application

Product Description

Master Bond Supreme 3CCM-85 is a toughened, one part epoxy system that can be used for bonding, sealing, coating, and especially glob tops and small encapsulation. First and foremost, the curing temperature for this system is 175-185°F for 2 to 3 hours, rather than the typical curing temperature of 250-300°F for a one part epoxy. This is especially significant because it allows this epoxy to be used in applications where plastic substrates are sensitive to temperatures exceeding 200°F. Supreme 3CCM-85 is not premixed and frozen and its working life is unlimited at room temperature. It has a viscosity and flow profile that is well suited for glob top and other encapsulation applications.

Supreme 3CCM-85 bonds well to a wide variety of substrates used in electronics including metals, composites, ceramics and many plastics. It has very good physical strength properties. The service temperature range for this system is from -100°F to +350°F. This system is capable of transferring heat while retaining its inherent electrical insulation profile. Also, it is a toughened system that can withstand various types of thermal cycling. While it is primarily used as a glob top material it also can be used for potting and bonding. Its color is black. The main use of this epoxy is for applications where heat curing above 200°F is not possible.

Product Advantages

  • One part system; no mixing needed
  • Very long open time
  • Thermally conductive, electrically isolating
  • Holds up to aggressive thermal cycling
  • Dispenses well for glob top applications
  • Cures at 175-185°F

Industrial Certifications

ASTM E595 Compliant




Supreme 3CCM-85 is available is various sizes and units to accommodate customer's needs.

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