Hot Off the Presses:
How to Simplify Potting

Potting compounds play a vital role in the assembly and long-term protection of delicate electronic components. The design tips in this paper will help you avoid the more common dilemmas associated with the selection and application of epoxy potting compounds.

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Master Bond EP21FRSPLV

This low viscosity,  two component epoxy adhesive has excellent flow and electrical insulation properties, making it ideal for potting, encapsulation and casting applications. Master Bond EP21FRSPLV features durability, toughness and high strength properties. It is resistant to thermal cycling and many chemicals including fuels, lubricants, water, acids, alkalis and salts. As per UL 94V-0 flame resistant specification, it is serviceable over the exceptionally wide temperature range of -51°C to 90°C.

Learn more about EP21FRSPLV. Check out some of our adhesives best suited for potting and encapsulation.

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Master Bond EP30DP

With a lower exotherm and an  exceptionally long working life, Master Bond EP30DP can be cured in sections up to a few inches thick. It features a low viscosity and exhibits very low shrinkage upon curing. This system also excels in withstanding rigorous thermal cycling along with mechanical and thermal shocks. EP30DP blends the performance characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethanes including toughness and abrasion resistance.

For more details on EP30DP please visit our product description.