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The unique requirements of microelectromechanical systems (MEMS) call for specialized materials. The versatility of epoxies and adhesives are often capable of providing the necessary properties to ensure support and protection from thermal and mechanical shock, vibration, high acceleration, particles, and other physical damage.
The combination of increasingly complex assemblies and exacting quality requirements is compelling design engineers to be extremely diligent when selecting materials for the assembly of medical electronic devices.In this white paper, we explore various polymer chemistries and what the different families of compounds have to offer for performance and processing requirements.
Selecting the right adhesive is a balancing act as engineers attempt to find products that meet conflicting end-use and manufacturability requirements. Medical device engineers also have to contend with a strict regulatory environment, and therefore often have the toughest time striking that balance.
With the trend toward smaller and smaller electronic devices, unintentional EMI/RFI interference has become more of an issue. Shielding of these interferences is critical and coatings can be successfully applied as protection on the materials used.
One of the most effective approaches to prevent and inhibit corrosion of metals is to create a protective barrier over the component. This is most easily achieved with the use of a coating compound. Coatings protect against corrosion, moisture and other chemicals from attacking metal parts.
Dielectric constant, dissipation factor, dielectric strength, surface and volume resistivity are all fundamental electrical properties of epoxies. How they are measured, what values are desirable and how they react to changes in temperature, fillers and other variables are considered in this paper.