Potting and Encapsulation CompoundsOur line of products consists of epoxies, silicones, polyurethanes and UV curable systems. They are used in low, medium, high voltage applications and feature outstanding electrical insulation properties, superior adhesive strength, thermal stability and superb chemical resistance. Products provide reliable long term performance for microelectronic, electronic, electrical devices, components including:

  • Power supplies
  • Switches
  • Ignition coils
  • Electronic modules
  • Motors
  • Connectors
  • Sensors
  • Cable harness assemblies
  • Capacitors
  • Transformers
  • Rectifiers

Properties of Potting, Encapsulation and Casting Systems

From "under the hood" to photovoltaic junction box assembly LED packaging to marine modules to submersible pumps Master Bond potting, encapsulation, casting materials are impervious to hostile environmental conditions. They offer the following advantages:

  • Enhanced thermal management properties
  • Exceptionally low coefficients of thermal expansion
  • Crack resistance
  • Protection against corrosion
  • Elevated temperature and cryogenic serviceability
  • Withstand rigorous thermal cycling and shock

Specific grades are used for tamper proofing, infiltrating densely packed components, sealing tightly wound coils, underfills, for high voltage indoor/outdoor applications where arcing/tracking are a concern and high vacuum situations. Additionally Master Bond offers optically clear UV curable systems including dual cure (UV/heat curable) compounds for "shadowed out" areas that pass 1000 hours at 85°C/85% RH testing.

Special Potting, Encapsulation and Casting Formulations

Many of our compounds have been formulated to meet strict industry standards, including:

  • UL 94V-0 for flame resistance
  • NASA low outgassing
  • USP Class VI for medical use
  • FDA CFR 175.300 for food grade

Low viscosity, self leveling rigid, semi-rigid and flexible compositions eliminate gas entrapment and are ideal for high volume production applications. These solvent free 100% solid systems feature low shrinkage, outstanding dimensional stability, excellent mechanical properties and can be dispensed manually/automatically. They guard against abrasion, shock, vibration, impact, UV, fungus, moisture exposure including salt water immersion. Specific grades exhibit superior thermal dissipation characteristics and have high glass transition temperatures. Heat activiated systems can be cured at low temperatures and exhibit low exotherm even in various wide cross section thicknesses. Soft, low durometer, resilient compositions have excellent stress relief properties for fragile, sensitive components. All products are ROHS compliant.

Learn more about the importance of a long pot life and low exotherm in potting, encapsulation and casting applications.

Some of Our Most Popular Potting, Encapsulation & Casting Epoxy Systems

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