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Two Part Epoxy System with
Outstanding Thermal Conductivity
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 Master
Bond EP21AOLV-1 is widely used in the electronic, electro-optical and
related industries where excellent heat transfer and electrical
insulation are required. While its primary use is for potting and
encapsulating, it is also an excellent adhesive that forms high strength
bonds. This versatile system will adhere to a wide variety of
substrates including metals, glass, ceramics and many plastics.
EP21AOLV-1 offers a low coefficient of expansion, excellent dimensional
stability, a high modulus and compressive strength. Some additional
product advantages include:
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Outstanding thermal conductivity, over 10 BTU•in/ft2 •hr•°F
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Convenient mixing: non-critical equal weight or volume ratio
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Excellent electrical insulation properties
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Superior durability and thermal shock resistance
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Very good resistance to chemicals including water, oils, fuels and many solvents
For more detailed information on EP21AOLV-1 including typical product properties, please visit our  |
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