Low temperature heat curing one part epoxy systems are formulated to cure at temperatures from 175 to 210°F (80° to 100°C). These systems are well suited for bonding heat sensitive substrates and engineered to fit other application requirements.
Low temperature heat curing systems are ideal for:
Bonding similar/dissimilar substrates with CTE differences
Minimizing thermal stress
Preventing warpage, cracking during temperature fluctuations
