Ideal for encapsulation, bonding and sealing
applications, Master Bond EP30Med offers a low viscosity, excellent
electrical insulation properties and exceptionally low shrinkage upon
cure. This two part epoxy produces high strength, rigid bonds to a
number of substrates, including metals, glass, ceramics, wood and many
plastics.
EP30Med readily withstands water, oils and many organic
solvents, as well as cold sterilants, EtO and gamma radiation. Most
importantly, it meets USP Class VI specifications, making it ideal for a
variety of uses in medical devices. EP30Med also meets FDA requirements
for indirect food contact as per FDA CFR 175.105. Some additional
product advantages include:
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Superior optical clarity
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Versatile cure schedules: room temperature curing, or
faster at elevated temperatures
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Broad service temperature range of -60°F to +250°F
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System contains no solvents or diluents
For more information on EP30Med please visit our full product description. |