Developed for chip-on-board encapsulation applications, Master Bond Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system that can be used for dam-and-fill.
Master Bond’s video library presents engineers with an extensive variety of videos that cover topics ranging from packaging to product highlights, from "how-to" demonstrations to best practices for using epoxies, and more. Browse through our library for a look at what Master Bond has to offer.
The selection process of an adhesive, coating or potting compound can pose a few challenges for engineers. Some of these include adhesion, temperature and thermal cycling resistance, and handling and curing time. For certain aerospace applications, compounds may need to pass NASA low outgassing specification ASTM E595 or UL 94V-0 for flame retardancy, for example.
Master Bond UV22DC80 is a one part nanosilica filled system for bonding, sealing and coating applications in the aerospace, optical and electronic industries.
EP29LPAO is a two component thermally conductive, electrically insulative epoxy well suited for potting and encapsulating.
This video explains proper handling and mixing techniques for this product as well as demonstrates various casting applications, highlighting its low exotherm and long working life.
Watch this video about Master Bond, formulator of advanced adhesives, sealants, coatings, potting/encapsulation compounds and impregnation resins.
Master Bond is keeping its 40th anniversary party going.