Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP30LP-2 High performance two part epoxy for bonding, coating, sealing and encapsulation Dielectric Strength 440 volts/mil Refractive Index 1.56	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling Potting	Part A: 900-1,600 cps, Part B: 100-400 cps	overnight at 75°F, followed by 2-3 hours at 150°F	75-85 Shore D	-60°F to +250°F	/es/tds/ep30lp-2
EP30LTE-2 Two component, room temperature curing epoxy for bonding, sealing, coating and encapsulating with low coefficient of thermal expansion Acoustical Impedance 6.4 MRayl Coefficient of Thermal Expansion 10-13 X 10⁻⁶ in/in/°C	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Encapsulation Potting Gap Filling	70,000-100,000 cps	overnight at 75°F followed by 2-4 hours at 150-200°F	85-95 Shore D	4K to +250°F	/es/tds/ep30lte-2
EP30LTE-LO Two component, low viscosity epoxy for bonding, sealing, coating and encapsulating Coefficient of Thermal Expansion 15-18 X 10⁻⁶ in/in/°C Dielectric Constant 4.5	MIL-STD-810G for Fungus Resistance NASA Low Outgassing RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Encapsulation Gap Filling Potting	Part A: 35,000-70,000 cps, Part B: 290-500 cps	75°F 48-72 hours, 200°F 2-3 hours, Optimum cure: Overnight at 75°F followed by 4-8 hours at 150°F to 200°F	85-95 Shore D	4K to +250°F	/es/tds/ep30lte-lo
EP30LTE-LO Black Two component epoxy for bonding, sealing, coating and encapsulating featuring a very low coefficient of thermal expansion Coefficient of Thermal Expansion 15-18 X 10⁻⁶ in/in/°C Dielectric Constant 4.5	NASA Low Outgassing RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Encapsulation Gap Filling Potting		Overnight at 75°F followed by 4-8 hours at 150°F to 200°F	85-95 Shore D	4K to +250°F	/es/tds/ep30lte-lo-black
EP30M4 Two component epoxy system for high performance applications Coefficient of Thermal Expansion 45-50 x 10⁻⁶ in/in/°C Volume Resistivity >10¹⁴ ohm-cm	1,000 Hours at 85°C/85% RH RoHS Compliant	Bonding Sealing Encapsulation Coating Gap Filling	Part A: 55,000-110,000 cps, Part B: 350-700 cps	overnight at 75°F followed by a few hours at 150-200°F	80-90 Shore D	-80°F to +300°F	/es/tds/ep30m4
EP30M4LV Two component epoxy system for high performance applications Coefficient of Thermal Expansion 45-50 x 10⁻⁶ in/in/°C Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant	Bonding Sealing Encapsulation Coating Gap Filling	Part A: 350-700 cps, Part B: 10,000-16,000 cps	overnight at 75°F followed by 2-4 hours at 150-200°F	80-90 Shore D	-80°F to +250°F	/es/tds/ep30m4lv
EP30Med Low viscosity, two component epoxy system Dielectric Strength 440 volts/mil Tensile Modulus 300,000-350,000 psi	FDA Food Grade 21 CFR 175.105 ISO 10993-5 for Cytotoxicity RoHS Compliant USP Class VI Medical 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Encapsulation Gap Filling	Part A: 900-1,500 cps, Part B: 280-500 cps	overnight at 75°F, followed by 1-2 hours at 150-200°F	75-85 Shore D	-60°F to +250°F	/es/tds/ep30med
EP30ND Two component, epoxy system for bonding, sealing and coating Coefficient of Thermal Expansion 45-50 in/in X 10⁻⁶/°C Dielectric Strength 450 volts/mil	RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: paste, Part B: 250-500 cps	overnight at 75°F followed by 2-3 hours at 150-200°F	80-90 Shore D	-60°F to +300°F	/es/tds/ep30nd
EP30NS Two part, nanosilica filled epoxy system for bonding, sealing, coating and encapsulation Coefficient of Thermal Expansion 25-30 X 10⁻⁶ in/in/°C Refractive Index 1.56	ASTM D4060-14 for Abrasion Resistance NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	30,000-60,000 cps	overnight at 75°F, followed by 2-3 hours at 150-200°F	80-90 Shore D	-60°F to +300°F	/es/tds/ep30ns
EP30P Low viscosity, two component epoxy system with excellent performance and compatibility with polycarbonates, acrylics and glass Dielectric Constant 3.6 Refractive Index 1.56	FDA Food Grade 21 CFR 175.105 RoHS Compliant	Bonding Sealing Coating Encapsulation	1,200-1,400 cps	75°F: 24-48 hours; 200°F: 2-3 hours	>75 Shore D	-60°F to +250°F	/es/tds/ep30p

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