EP21DP11 Red

Master Bond Polymer System EP21DP11 Red is a low viscosity, two component, flexible epoxy compound for high performance bonding, sealing, casting, coating, and potting applications. It has a convenient 2 to 1 mix ratio by weight and is formulated to cure at ambient temperatures or more rapidly at elevated temperatures. This compound is 100% reactive and does not contain any solvents or diluents. It has low shrinkage upon curing.

The system adheres well to a wide variety of substrates including metals, composites, glass and many plastics. It is especially noteworthy for its toughness and its ability to withstand rigorous thermal cycling, as well as thermal and mechanical shock. It has good resistance to water, fuels and oils. Its service temperature range extends from -80°F to +250°F. Part A is red and Part B is amber clear. EP21DP11 Red is a dependable electrical insulator with a good dielectric constant and volume resistivity. This epoxy can be used in aerospace, medical devices, specialty OEM and related applications, especially as a potting and encapsulating system where the ability to withstand repeated temperature cycling is important.

Product Advantages

• 2:1 mix ratio by weight
• Low viscosity, well suited for casting and potting
• Low exotherm
• Highly resistant to thermal cycling
• Easily visible red color