News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	Optically Clear, High Flexibility Silicone Meets NASA Low Outgassing Specifications Release Date: 06/05/2026 Product: MasterSil 981-LO Master Bond MasterSil 981-LO is a two component, addition cured silicone system designed for bonding, sealing, coating, and encapsulating applications. It meets NASA low outgassing specifications and features optical clarity, particularly in thin sections, making it well suited for aerospace, satellite, optical, and… Read More...
	NASA Low Outgassing, Chemically Resistant Epoxy Features High Tg Release Date: 05/01/2026 Product: EP64 Master Bond EP64 is a two-component, vacuum-compatible epoxy system engineered for bonding, sealing, and coating applications. It features a high glass transition temperature (T_g) of 210–215°C and meets NASA low outgassing specifications per ASTM E595 testing. This product is resistant to a variety of chemicals—… Read More...
	Non-Frozen, Silver Filled Epoxy Features High Thermal and Electrical Conductivity Release Date: 03/30/2026 Product: EP6STC-80 Master Bond EP6STC-80 is a one component, non-frozen, silver filled epoxy engineered for bonding, sealing, and coating applications requiring exceptional thermal and electrical conductivity. This system offers an unlimited working life at room temperature and achieves a full cure at a moderate temperature of 80°C. EP6STC-80… Read More...
	Dual Cure Medical Adhesive Features High Tg and Autoclave Resistance Release Date: 02/18/2026 Product: UV26DCMed Master Bond UV26DCMed is a one component, dual cure adhesive system designed for medical device assembly. It is specifically engineered for reusable devices that require repeated sterilization, including steam autoclaving, ethylene oxide, and glutaraldehyde. The system also demonstrates compatibility with various hydrogen… Read More...
	Electrically Insulating Epoxy Features Ultra-High Thermal Conductivity Release Date: 01/14/2026 Product: EP54TC Master Bond EP54TC is a two-component epoxy engineered for heat sink bonding and thermal management applications where efficient heat transfer is critical. Featuring the highest thermal conductivity in the Master Bond electrically insulating portfolio—exceeding 6 W/(m·K)—it delivers exceptional heat dissipation while remaining… Read More...