Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications. “EP13LTE is very convenient to use, since it doesn’t require mixing, and has an unlimited working life at room temperature,” said Venkat Nandivada, manager of technical support.

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for bonding and sealing. “EP17HTDA-1 has the ideal viscosity and flow for die attach applications,” said Rohit Ramnath, senior product engineer.

Developed for priming and bonding polyolefinic substrates, Master Bond X21Med is a single component elastomeric compound that passes ISO 10993-5 tests for cytotoxicity. “This specialty system was designed to be used as a primer that would promote adhesion between polyolefins and other surfaces such as metals, ceramics, composites and other kinds of plastics.

Master Bond EP39MAOHT is a room temperature curing system for demanding bonding, sealing, coating, potting and encapsulation applications. “It is a versatile product that combines convenient handing, good flow, thermal conductivity, electrical insulation and high temperature resistance,” said Robert Michaels, vice president of technical support.

Master Bond EP41S-F is a two part epoxy for bonding, sealing, coating and encapsulation applications. It combines fast ambient temperature cure speed with  chemical resistance and superior electrical insulation properties. This versatile system is easy to handle and has a forgiving 100 to 25 mix ratio by weight.

Formulated to meet rigorous Airbus specifications, Master Bond EP93FRHT passes the twelve second vertical burn test per AITM 2.0002B and Section 7.1.2 of ABD0031, Issue F; the smoke emission test per AITM 2.0007B, Issue 3 in the flaming mode and Section 7.3.2 of ABD0031, Issue F; and the toxic gas emission test per AITM 3.0005, Issue 2 in the flaming mode and Section 7.4 of ABD0031, Issue

Pages