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Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
Supreme 11AOHTLP Two component, thermally conductive, electrically insulative epoxy for bonding, sealing and coating Dielectric Constant 4.6 Tensile Modulus 400,000-450,000 psi	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	overnight at 75°F followed by 3-4 hours at 150-200°F	85-90 Shore D	-112°F to +400°F	/it/tds/supreme-11aohtlp
Supreme 11AOHTMed Toughened, high strength, two component epoxy for bonding and sealing Dielectric Constant 4.6 T-peel Strength 15-20 pli	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 200,000-300,000 cps, Part B: paste	75°F: 24-36 hours; 200°F: 1-2 hours	80-90 Shore D	-112°F to +400°F	/it/tds/supreme-11aohtmed
Supreme 11HT Toughened, two component epoxy for bonding, sealing and coating Coefficient of Thermal Expansion 45-50 X 10⁻⁶ in/in/°C Tensile Lap Shear Strength 3,200-3,400 psi	RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 90,000-120,000 cps, Part B: 60,000-110,000 cps	overnight at 75°F, followed by 1 hour at 150-200°F	75-85 Shore D	-112°F to +400°F	/it/tds/supreme-11ht
Supreme 121AO Two part toughened epoxy for bonding, sealing and encapsulation features good thermal conductivity Glass Transition Temperature (Tg) 200-210°C Thermal Conductivity 4-5 BTU•in/(ft²•hr•°F)	NASA Low Outgassing RoHS Compliant	Bonding Sealing Encapsulation Potting Coating Gap Filling	10,000-25,000 cps	1-2 hours at 200-210°F followed by 3-4 hours at 250°F and then 4-6 hours at 300°F. Additional post curing at 350°F for 2-4 hours will further enhance product properties.	85-95 Shore D	-80°F to +550°F	/it/tds/supreme-121ao
Supreme 121AOMed Two part toughened epoxy for bonding, sealing and potting featuring good thermal conductivity and high temperature resistance; requires oven curing Glass Transition Temperature (Tg) 200-210°C Thermal Conductivity 4-5 BTU•in/(ft²•hr•°F) [0.58-0.72 W/(m•K)]	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing Encapsulation Potting Coating Gap Filling	10,000-25,000 cps	1-2 hours at 200-210°F followed by 3-4 hours at 250°F and then 4-6 hours at 300°F. Additional post curing at 350°F for 2-4 hours will further enhance product properties.	85-95 Shore D	-80°F to +550°F	/it/tds/supreme-121aomed
Supreme 121AOND Two part toughened epoxy for bonding, sealing and encapsulation features good thermal conductivity Glass Transition Temperature (Tg) 200-210°C Thermal Conductivity 4-5 BTU•in/(ft²•hr•°F)	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	1-2 hours at 200-210°F followed by 3-4 hours at 250°F and then 4-6 hours at 300°F. Additional post curing at 350°F for 2-4 hours will enhance properties.	85-95 Shore D	-80°F to +550°F	/it/tds/supreme-121aond
Supreme 12AOHT-LO One part, thermally conductive, electrically insulating, high performance epoxy for bonding and sealing; meets NASA low outgassing specifications Glass Transition Temperature (Tg) 135-140°C Tensile Lap Shear Strength 3,400-3,600 psi	1,000 Hours at 85°C/85% RH MIL-STD-883J for Thermal Stability NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	125°C (257°F) in 60-70 minutes and 150°C (302°F) in 40-50 minutes	80-90 Shore D	4K to +500°F	/it/tds/supreme-12aoht-lo
Supreme 17HT One component toughened epoxy system for bonding and sealing Glass Transition Temperature (Tg) 208-210°C Tensile Lap Shear Strength 1,900-2,100 psi	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	100,000-150,000 cps	300°F for 4-6 hours, plus 8-12 hours at 350°F.	80-90 Shore D	-100°F to +550°F	/it/tds/supreme-17ht
Supreme 17HTMed One component, medical grade toughened epoxy system for bonding and sealing Glass Transition Temperature (Tg) 208-210°C Tensile Lap Shear Strength 1,900-2,100 psi	RoHS Compliant ISO 10993-5 for Cytotoxicity	Bonding Sealing Coating Gap Filling	100,000-150,000 cps	4-6 hours at 300°F or 2-4 hours at 350°F	80-90 Shore D	-100°F to +550°F	/it/tds/supreme-17htmed
Supreme 17HTND-2 One component toughened epoxy system for bonding and sealing Glass Transition Temperature (Tg) 208-210°C Tensile Lap Shear Strength 1,900-2,100 psi at 75°F	NASA Low Outgassing RoHS Compliant	Bonding Sealing Gap Filling Coating	paste	300°F for 4-6 hours or 350°F for 2-4 hours; recommended cure schedule is 4-6 hours at 300°F followed by a post cure of 8-12 hours at 350°F	80-90 Shore D	-100°F to +550°F	/it/tds/supreme-17htnd-2

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