EP30F

Highly versatile, two part epoxy system for bonding, coating, sealing and casting
Key Features
  • Superb optical clarity
  • Fast setting
  • Low viscosity
  • High bonding strength to a wide variety of substrates
Typical Properties
Viscosity
Part A: 300-700 cps, Part B: 2,000-4,000 cps
Cure Schedule
overnight at 75°F, followed by 1-2 hours at 150-200°F
Hardness
>75 Shore D
Service Temperature Range
-60°F to +250°F
Dielectric Constant
3.55
Dielectric Strength
440 volts/mil
Dissipation Factor
0.005
Linear Shrinkage
less than 0.003 in./in.
Refractive Index
1.57
Volume Resistivity
>10¹⁵ ohm-cm
EP30F Two Component Epoxy
Discuss with a Specialist
(1-2 Business Day Request) Get Technical Data sheet
(Instant Email Delivery) Request Safety Data sheet
(1-2 Business Day Request)
Applications

Bonding

bonding

Sealing

sealing

Coating

Coating

Encapsulation

encapsulation

Potting

potting
Certifications

Meets EU Directive 2015/863

Packaging

Cans

FlexiPack

Gun Applicator

Pails

Premixed & Frozen Syringe

Syringes

Product Description

Master Bond EP30F is a low viscosity, two component epoxy system for high performance bonding, coating, sealing, potting and encapsulation. It readily cures at room temperature or more rapidly at elevated temperatures, and has a four to one mix ratio by weight. EP30F is a fast setting system that typically has a handling time of 25-30 minutes. This adhesive is 100% reactive and does not contain any solvents or diluents. EP30F has outstanding physical strength properties along with highly reliable electrical insulation characteristics. This dimensionally stable system has very low linear shrinkage after cure, less than 0.003 in./in. EP30F possesses very good optical clarity along with superior light transmission when compared to many other epoxies. EP30F bonds well to a variety of substrates including metals, glass, and ceramics, as well as many plastics and rubber materials. EP30F forms high strength, rigid bonds that resist chemicals including water, oils and fuels. Its low viscosity enables this system to be used for special gap filling applications where space is limited. Master Bond EP30F is widely used in electronic, electrical, optical, fiber-optic, aerospace and related industries, particularly where low viscosity and faster curing are desirable.

Product Advantages

  • Easy to use mix ratio—four to one by weight
  • Easy application: only contact pressure required while curing; adhesive spreads readily
  • Versatile cure schedules: ambient temperature cures or faster at higher temperatures
  • Low viscosity; ideal for gap filling applications and smaller encapsulations
  • Exceptional physical strength and electrical insulation properties
  • Relatively short fixture time
Discuss with a Specialist
(1-2 Business Day Request) Get Technical Data sheet
(Instant Email Delivery) Request Safety Data sheet
(1-2 Business Day Request)
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How to order

Verify Your Product Selection

With thousands of custom formulations available, our expert engineers provide personalized consultation to ensure you select the ideal adhesive. We will follow up with a product and packaging recommendation for your specific application.

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Our customer service team will follow up with a detailed quote with packaging and shipping options.

Place Your Order

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Receive Your Material

Your adhesive will be made to order and shipped to you. Typical lead times are 10-14 business days, with rush options available for urgent orders.

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