EP30C
Two component, nickel filled epoxy for bonding, sealing and coating
Key Features
- Good electrical and thermal conductivity
- Excellent for EMI/RFI shielding
- Reliable gap filling properties
- Superior dimensional stability
Typical Properties
Viscosity
Paste
Cure Schedule
overnight at ambient temperatures followed by 1-2 hours at 150°F
Hardness
80-90 Shore D
Service Temperature Range
-60°F to +250°F
Coefficient of Thermal Expansion
25-30 X 10⁻⁶ in/in/°C
Thermal Conductivity
8-9 BTU•in/(ft²•hr•°F) [1.15-1.30 W/(m•K)]
Volume Resistivity
5-20 ohm-cm
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