#5: Master Bond Supreme 3AOProviding
the convenience of a one component, no mix formulation, Supreme
3AO offers a superb balance of high strength properties, fast cures and
thermal conductivity. It passes rigorous NASA low outgassing tests,
making it ideal for bonding, sealing, coating and encapsulation
applications in vacuum environments.
#4:
Master Bond EP42HT-2AO-1 BlackEP42HT-2AO-1
Black features outstanding temperature and chemical resistance and is
widely used in a variety of potting and encapsulation applications where
thermal conductivity is needed. This cryogenically serviceable system
also meets NASA low outgassing requirements.
#3:Master Bond EP21TDCANHTAs
a flexibilized system, EP21TDCANHT is well suited for bonding
dissimilar substrates over the wide service temperature range of -100°F
to 400°F. It has exceptionally high thermal conductivity and withstands
severe thermal cycling.
#2:
Master Bond EP30AN-1
Certified to meet NASA low outgassing requirements, EP30AN-1 offers
remarkable thermal conductivity and excellent electrical insulation
properties for high performance potting, sealing, coating and bonding
applications. This two part system also features robust chemical
resistance and good dimensional stability.
#1:
Master Bond Supreme 10AOHTSupreme
10AOHT delivers an outstanding combination of performance properties
such as excellent thermal conductivity, superior electrical insulation
and the ability to withstand thermal cycling. This toughened, one
part epoxy bonds well to a variety of substrates over the wide
temperature range of 4K to 400°F.
