EP21TDCANHT Product Description
Two Component Thermally Conductive, Electrically Insulative
Epoxy Adhesive Flexibilized For High Performance Bonding
Featuring Exceptionally High Thermal Conductive
EP21TDCANHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally high peel strength and tensile lap shear. It has a very convenient mix ratio(1:1), weight or volume, and is serviceable over an exceptionally wide temperature range of -100 to 400°F. As a flexibilized system, it is an ideal adhesive for bond dissimilar substrates when thermal conductivity is needed. EP21TDCANHT has superior thermal and mechanical shock resistance and is readily thermally cyclable. Finally, EP21TDCANHT offers very high thermal conductivity.
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- Epoxy |
- Heat Cure |
- Room Temperature Cure |
- Electrically Insulative |
- High Temperature Resistant |
- High Peel Strength |
- Thermal Cycling Resistant |
- High Shear Strength |
- Thermally Conductive |
- Flexibilized & Toughened |
- Vibration, Shock & Impact |
