News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.
 

Release Date:
Product: MasterSil 705TC

Placing an emphasis on convenient handling, Master Bond MasterSil 705TC features a paste consistency that doesn’t require mixing. This single component system sets up in 7 minutes and has a non-corrosive cure at room temperature when exposed to atmospheric humidity.

Suitable for a variety of bonding, sealing and…

Release Date:
Product: Super Gel 9AO

Primarily used for potting and encapsulation applications, Master Bond Super Gel 9AO is a soft, urethane modified gel-like epoxy that offers thermal conductivity and electrical insulation properties. This two part system is also employed for bonding and sealing as it adheres well to a variety of substrates including metals,…

Release Date:
Product: EP38CL

Master Bond EP38CL was developed for bonding, sealing, coating and encapsulation applications that require toughness and durability. With a Shore D hardness exceeding 75, its toughness is a unique property that imparts resistance to rigorous thermal cycling, impact and mechanical shock.

EP38CL cures at room temperature…

Release Date:
Product: EP79FL

Formulated with a silver coated nickel filler, Master Bond EP79FL is a two part, electrically conductive epoxy for bonding, sealing and coating applications. It has low volume resistivity of less than 0.005 ohm-cm and is suitable for a variety of uses in the electronic, aerospace, computer, semiconductor and electro-optic…

Release Date:
Product: Supreme 3HTND-2GT

Featuring the combination of electrical insulation properties and thermal conductivity, Master Bond Supreme 3HTND-2GT can be used for a variety of applications including bonding, sealing, glob top and die attach. This toughened epoxy system bonds well to a wide variety of substrates used in electronics, including metals,…