News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	Silver Conductive Epoxy Meets NASA Low Outgassing Standards Release Date: 06/17/2011 Product: EP21TDCS-LO Master Bond EP21TDCS-LO is an electrically conductive silver-filled epoxy that passes ASTM 595 for NASA low outgassing specifications. It is widely used for demanding applications in the electronic, electrical, computer, semiconductor, aerospace and optical industries. The adhesive cures at room temperature in 24-48 hours… Read More...
	Low Viscosity, Room Temperature Curing Epoxy Complies With FDA and USP Class VI Requirements Release Date: 06/09/2011 Product: EP21LV Ideal for potting and encapsulation applications, Master Bond EP21LV features a low viscosity and outstanding electrical insulation properties. It is broadly used in the medical and food industries, as it conforms to USP Class VI and Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 requirements. … Read More...
	New, Versatile Food Grade Epoxy Resists High Temperatures & Harsh Conditions Tested and Certified to Meet FDA CFR 175.300 Release Date: 05/19/2011 Product: EP42HT-2FG Master Bond is pleased to announce the release of EP42HT-2FG, a new food grade epoxy system. EP42HT-2FG has been independently tested and certified by a leading national laboratory to meet the stringent requirements of FDA CFR 175.300. It also was toxicologically evaluated to meet the NSF/ANSI 51.4.1 (2009) standard for food… Read More...
	Low Thermal Expansion Epoxy Passes NASA Low Outgassing Tests Release Date: 04/19/2011 Product: EP30LTE-LO Formulated with a special blend of polymeric and inorganic materials, Master Bond EP30LTE-LO features unparalleled dimensional stability and sets new standards of performance for bonding, sealing, casting and coating applications in the aerospace, electrical, electronic, chemical, optical, and computer industries. This two… Read More...
	Optically Clear, Highly Flexible Epoxy Cures at Room Temperature and Withstands Cryogenic Conditions Release Date: 03/24/2011 Product: EP37-3FLF For demanding applications where highly flexible, impact resistant bonds are required, Master Bond developed Polymer System EP37-3FLF. This optically clear, two component epoxy has exceptional resistance to cryogenic temperatures and severe thermal cycling. Its low exotherm also makes it a superb potting, encapsulating and… Read More...