News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.
 

Release Date:
Product: EP30FL

A new flexible, tough epoxy potting and encapsulation compound called EP30FL has been introduced by Master Bond Inc., Hackensack, NJ. Master Bond EP30FL has extraordinarily low viscosity and is easy to apply. It can be used in both thick and thin cross sections. This compound is 100% reactive and does not contain any…

Release Date:
Product: EP21TDCSFL

Master Bond EP21TDCSFL is a new two component, room temperature curing, silver filled, epoxy adhesive developed by Master Bond Inc., Hackensack, N.J. It exhibits high flexibility and has an elongation of >60%. EP21TDCSFL is easy to use and has a 1 to 1 mix ratio by weight or volume. It cures at room temperatures or more…

Release Date:
Product: MasterSil 151

MasterSil 151 is a new two component, low viscosity silicone compound for high performance casting, potting and encapsulation introduced by Master Bond Inc., Hackensack, N.J. This formulation is designed to cure at room temperature or more rapidly at elevated temperatures. MasterSil 151 has superior electrical insulation…

Release Date:
Product: EP27

Achievement of high performance cures at low temperatures has long been a problem for epoxy resin compositions. Master Bond Inc. has successfully overcome this problem with a newly developed epoxy resin system called Master Bond EP27. In 6 mil thick films, EP27 will set in as little as 2 hours at only 40°F and will cure in 48-…

Release Date:
Product: EP40

Master Bond has successfully developed a new, highly flexible two component epoxy resin compound called EP40 which features outstanding shear and peel strength and is especially designed for bonding, sealing and casting engineering plastics and metals. This compound has been formulated to cure readily at ambient or more quickly…