News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	New Room Temperature Curing Epoxy Resists Sterilization Release Date: 08/04/2004 Product: EP42HT-2 Master Bond Inc. of Hackensack, New Jersey has introduced a new room temperature curing, two component epoxy adhesive, sealant, coating and casting material called EP42HT-2. This compound features high temperature resistance along with outstanding chemical resistance. It is widely used in medical devices because of its ability… Read More...
	New Fast Curing Epoxy Adhesive Release Date: 06/01/2004 Product: EP24 Master Bond Inc. of Hackensack, New Jersey has developed EP24, new fast curing, two component epoxy adhesive. This high performance system cures at room temperature or more rapidly at elevated temperatures. Additionally, it will cure at colder temperatures, down to 20°F. It is easy to use and has a convenient non critical mix… Read More...
	New Epoxy Adhesive Resists High Temperatures Release Date: 03/15/2004 Product: EP35 A unique two component, room temperature curing, high temperature resistant epoxy adhesive called EP35 has been introduced by Master Bond Inc., Hackensack, N.J. This system produces high strength bonds whose strength is maintained even after long exposures to temperatures in the 450°F-500°F range. It has a 100 to 70 mix ratio… Read More...
	Thermal Conductive Adhesive has Convenient One to One Mix Ratio Release Date: 02/02/2004 Product: EP21AO Master Bond EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive with a forgiving 1 to 1 mix ratio by weight or volume. Developed by Master Bond Inc., Hackensack, N.J. this compound is extremely versatile and will adhere well to variety of similar and dissimilar substrates. It has a low… Read More...
	Rapid Curing Epoxy Adhesive Has High Flexibility Release Date: 06/12/2003 Product: EP51FL Master Bond EP51FL is a new two component, highly flexible epoxy resin system developed by Master Bond Inc., Hackensack, N.J. for high performance bonding. EP51FL has a 1 to 1 mix ratio, weight or volume. It cures rapidly at room temperature and has a setup time of 30-40 minutes. Cure speeds can be accelerated by the use of… Read More...