News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	Tough Epoxy Polysulfide Adhesive Resists High Temperatures Release Date: 01/14/2020 Product: EP21TPHT Master Bond EP21TPHT is a new two component epoxy polysulfide system designed for bonding applications that require toughened and thermally stable bonds resistant to chemicals. It resists temperatures up to 350°F, much higher than typical epoxy polysulfide systems. This room temperature curable adhesive also features convenient… Read More...
	Toughened, Urethane Based Epoxy System Meets USP Class VI Specifications Release Date: 12/20/2019 Product: EP30DPBFMed Master Bond EP30DPBFMed is a two part, flexibilized epoxy-urethane hybrid system that can be used for bonding, sealing, coating, and encapsulation. It is formulated for disposable and reusable medical devices, meeting USP Class VI requirements while also complying with RoHS3 in accordance with the EU directive 2015/863/EU.… Read More...
	Underfill Epoxy Offers Thermal Conductivity and Electrical Insulation Release Date: 11/21/2019 Product: EP29LPTCHT Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications. It does not need excessive heat for curing and has a long working life at room temperature. This system is electrically insulative and thermally conductive with very fine… Read More...
	Thermally Conductive, Chemically Resistant Epoxy Sealant Release Date: 10/30/2019 Product: EP62-1AO Master Bond EP62-1AO is a two part epoxy adhesive and sealant with an exceptionally long working life of 12-14 hours at ambient temperature for a 100 gram mass. This makes it beneficial when bonding and sealing large or intricate parts that may need ample time for mixing and applying. This material has a high strength profile… Read More...
	Thermally Conductive, Electrically Insulative Potting Compound Resists High Temperatures Release Date: 10/10/2019 Product: Supreme 121AO Master Bond Supreme 121AO is a NASA low outgassing approved epoxy suitable for bonding, sealing and potting applications. Featuring a high glass transition temperature of 200-210°C, it resists temperatures up to 550°F. This system exhibits an element of toughness, and is not as stiff as conventional epoxies that withstand… Read More...