News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	Toughened, Low Outgassing, One Component Epoxy Features Thermal Cycling Resistance Release Date: 05/15/2019 Product: Supreme 17HT Master Bond Supreme 17HT is a single component, no mix epoxy system for bonding and sealing applications featuring an unlimited working life at room temperature. “This thermally stable formulation has a high glass transition temperature of 410°F (210°C) and retains its bond strength at elevated temperatures,” says Rohit Ramnath,… Read More...
	Dual Curing Epoxy Meets Biocompatibility and Cytotoxicity Requirements Release Date: 04/22/2019 Product: UV22DC80-1Med Master Bond UV22DC80-1Med is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. Not only does it pass USP Class VI tests for biocompatibility, but it also meets ISO 10993-5 for cytotoxicity, making it ideal for many applications in the medical device industry. As a nanosilica… Read More...
	Graphene Filled Epoxy Offers 5.5 W/(m•K) Thermal Conductivity Release Date: 04/02/2019 Product: EP30NG Master Bond EP30NG is a two part epoxy adhesive system developed for applications that require high thermal conductivity. It contains a specialty graphene filler which contributes not only to its high compressive strength, but also to its enhanced dimensional stability. EP30NG achieves an extraordinary thermal conductivity of… Read More...
	Silver Conductive, One Component Epoxy Cures at 80°C Release Date: 03/12/2019 Product: Supreme 3HTS-80 Master Bond Supreme 3HTS-80 is a one part, silver filled epoxy adhesive that is not premixed and frozen and features an unlimited working life at room temperature. “While typical heat activated epoxies require 250°F to 350°F to cure, Supreme 3HTS-80 cures at 175°F to 185°F within 2-3 hours” says Rohit Ramnath, Senior Product… Read More...
	Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test Release Date: 02/25/2019 Product: EP93AOFR Master Bond EP93AOFR is a two part epoxy that may be used in encapsulation and potting applications, as well as in bonding, sealing and coating. According to Rohit Ramnath, Senior Product Engineer, "This flame retardant non-halogenated system is not only thermally conductive, 9-10 BTU•in/ft²•hr•°F [1.30-1.44 W/(m•K… Read More...