News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	High Tg, Ultra Low Viscosity Epoxy meets NASA Low Outgassing Specifications Release Date: 09/17/2019 Product: Supreme 112 Master Bond Supreme 112 is a new two part epoxy for bonding, sealing, potting, and impregnation applications. It is a heat curable system with a very low viscosity of 50-200 cps and a long open time of 2-3 days at room temperature for a 100 gram batch. Supreme 112 features a high glass transition temperature of 190-195°C and is… Read More...
	UV Curing Adhesive Passes NASA Low Outgassing Specifications Release Date: 08/19/2019 Product: UV10TK40M Master Bond UV10TK40M is a one part UV curable system, which is not oxygen inhibited, and can be used for bonding, sealing and coating applications. UV10TK40M is optically clear, with a refractive index of 1.55. It has a high glass transition temperature (T_g) of 135-140°C and is serviceable from -60°F to +450°F. Its… Read More...
	Toughened Epoxy Polysulfide Hybrid Offers Advanced Chemical Resistance Release Date: 07/16/2019 Product: EP21TP-2NV Master Bond EP21TP-2NV is a two part epoxy polysulfide formulated for use as an adhesive, sealant and potting system. It withstands prolonged exposure to many harsh chemicals including fuels, oils, hydrocarbons and hydraulic fluids. It is also fully RoHS compliant, meeting RoHS3 Directive (EU) 2015/863. EP21TP-2NV… Read More...
	Non-Premixed and Frozen, One Part Epoxy for Chip Coating Release Date: 06/25/2019 Product: Supreme 3CCM-85 Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a new single component epoxy initially designed for glob top and chip coating applications. However, this system can also be utilized for encapsulation and bonding. Supreme 3CCM-85 cures within 2-3 hours at 175-… Read More...
	Optically Clear, Low Viscosity Epoxy System Features High Flexibility Release Date: 06/06/2019 Product: EP88FL Two component epoxy, Master Bond EP88FL, is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation. It is easy to use, with a mixing ratio of one to one by weight or volume. EP88FL withstands thermal cycling and shock. It is ideal in applications where stress… Read More...