News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications Release Date: 08/22/2016 Product: EP21TDCN-LO Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system and is capable of withstanding rigorous thermal cycling, mechanical vibration and shock. This… Read More...
	Solvent Resistant Adhesive Withstands Methylene Chloride, Alcohols and Fuels Release Date: 08/01/2016 Product: EP41S-5 Formulated for bonding, sealing, coating and encapsulation applications, Master Bond EP41S-5 is a room temperature curing epoxy that combines a high strength profile, superior electrical insulation values and exceptional chemical resistance. This system can be used in the aerospace, electronic, power, chemical processing,… Read More...
	No Mix, Thermally Conductive, Electrically Insulative Epoxy for Underfill Applications Release Date: 07/11/2016 Product: EP3UF Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10^-6 K•m²/W. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal… Read More...
	Nanosilica Filled, Dual Cure Adhesive Meets NASA Low Outgassing Specifications Release Date: 06/20/2016 Product: UV22DC80-1 Master Bond UV22DC80*** is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating with the ability to cure under UV light and/or with heat. The UV portion of the cure can be achieved in seconds upon exposure to a UV light at 365 nm with 20-40 milliwatts/cm² of energy.… Read More...
	Thermally Conductive, Electrically Insulative Epoxy Features Long Working Life Release Date: 05/31/2016 Product: EP29LPAO Well suited for large potting and encapsulation applications, Master Bond EP29LPAO is a cost effective, two part system with a low viscosity, excellent flow properties and heat dissipation properties. Featuring convenient processing, this epoxy has a forgiving 100 to 50 mix ratio by weight and a pot life of 7-9 hours at room… Read More...