News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	One Component, High Strength Epoxy for Structural Bonding Applications Release Date: 06/29/2015 Product: EP13SPND-2 Formulated primarily for high performance structural bonding applications, Master Bond EP13SPND-2 is a one part, high temperature resistant epoxy for the aerospace and specialty OEM industries. As a single component system, this product is easy to handle and does not require mixing prior to use. It also has an unlimited… Read More...
	One Component, Neutral Curing Silicone Passes USP Class VI and ISO 10993-5 Tests Release Date: 06/08/2015 Product: MasterSil 912Med Specially formulated for medical device applications, Master Bond MasterSil 912Med is a room temperature vulcanizing silicone system for high performance bonding, sealing and coating. This system meets both USP biocompatibility and ISO cytotoxicity standards and resists a variety of sterilization techniques such as gamma… Read More...
	Flexible, Two Component Epoxy Polysulfide System Features High Thermal Conductivity and Excellent Electrical Insulation Properties Release Date: 05/18/2015 Product: EP21TPFL-1AO Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU•in/ft²•hr•°F [1.30-1.44 W/(m·K)]. As a polysulfide based system, it has very good chemical resistance, particularly to fuels, oils, hydraulic fluids and related compounds. This unusual… Read More...
	Toughened, One Component Epoxy Features High Bond Strength and Cryogenic Serviceability Release Date: 04/27/2015 Product: Supreme 10HTF-1 Combining simple handling properties with high strength, Master Bond Supreme 10HTF-1 is a single part adhesive/sealant for a variety of applications in the aerospace, electronic, optical, specialty OEM and related industries. At room temperature, this smooth paste system has an “unlimited” working life and cures rapidly at… Read More...
	Two Component Epoxy with Ultra Low Thermal Resistance and Superior Electrical Insulation Properties Release Date: 04/06/2015 Product: EP48TC Featuring special high thermal conductive fillers, Master Bond EP48TC is two part epoxy paste that can be applied in bond lines as thin as 10-15 microns. This material offers exceptionally low thermal resistance of 5-7 x 10^-6 K•m²/W, which imparts impressive heat transfer capabilities and thermal… Read More...