News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	One Part, Electrically Conductive Epoxy Meets NASA Low Outgassing Specifications Release Date: 05/09/2016 Product: EP3HTS-LO Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries. Featuring a silver filler, EP3HTS-LO is electrically… Read More...
	Nanosilica Filled, Optically Clear Epoxy Features Superior Electrical Insulation Properties Release Date: 04/21/2016 Product: EP113 Master Bond EP113 is a nanosilica filled epoxy that delivers enhanced dimensional stability and exceptionally low shrinkage upon curing. This optically clear, two component system is well suited for applications in the aerospace, electronic and OEM industries. Featuring an ultra low mixed viscosity of 80-140 cps, EP113… Read More...
	Flexible, One Component, Fast Curing Silicone for Medical Device Applications Release Date: 03/28/2016 Product: MasterSil 910Med Master Bond MasterSil 910Med is a one part acetoxy type silicone system that meets USP Class VI specifications for biocompatibility and ISO 10993-5 testing for cytotoxicity. This translucent paste also withstands many sterilization methods, including liquid sterilants, gamma radiation and EtO. As a silicone, MasterSil… Read More...
	Toughened, High Strength, Two Component Epoxy Offers Chemical, Abrasion and High Temperature Resistance Release Date: 03/10/2016 Product: Supreme 45HTQ-4 Featuring a silicon carbide filler, Master Bond Supreme 45HTQ-4 is a toughened epoxy for high performance bonding, sealing, coating and casting. This specialty system can be used for a wide variety of special industrial, aerospace, OEM and oil processing applications, especially in downhole situations. Supreme 45HTQ-4… Read More...
	Toughened One Component Epoxy for Chip Coating Applications Meets NASA Low Outgassing Specifications Release Date: 02/22/2016 Product: Supreme 3HTND-2CCM Formulated for many electronic applications, Master Bond Supreme 3HTND-2CCM is a multifunctional epoxy that is well suited for chip coating, glob top and die attach applications as well as for bonding, sealing and encapsulation. Since it is a one part system, it does not require mixing and has an “unlimited” working life at… Read More...