News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.
 

Release Date:
Product: EP17HT-100

Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220°F. Cures can be accelerated at higher temperatures. This low heat curing schedule is useful in bonding applications involving temperature sensitive…

Release Date:
Product: MasterSil 930

With enhanced chemical resistance Master Bond MasterSil 930 is an acetoxy type fluorosilicone for bonding, sealing and coating applications in aerospace, electronics, specialty OEM and other industries. This one part system is able to withstand exposure to water, fuels, oils, greases, refrigerants, acids, bases and solvents…

Release Date:
Product: EP21NDCL

Master Bond EP21NDCL is a unique two component epoxy system that cures optically clear in thin sections, even though Part A is translucent and Part B is light amber. This non-drip compound is formulated for a variety of bonding, sealing and coating applications in the optical, opto-electronic, electrical, aerospace and…

Release Date:
Product: EP3RR-80

Developed for a variety of bonding, sealing, potting and encapsulation applications, Master Bond EP3RR-80 is a one component epoxy that offers user friendly handling. It has a moderate viscosity, good flow properties and an unlimited working life at ambient temperatures. Additionally, this system can be stored at 40-50°F and…

Release Date:
Product: EP121CL-LO

Widely used for applications in the aerospace, electronic and OEM industries, Master Bond EP121CL-LO is a high performance epoxy that passes ASTM E595 testing for NASA low outgassing specifications. This two component system has a low mixed viscosity of 1,000-3,000 cps with a mix ratio of 100:80 by weight. It features an…