Featuring a non-halogen filler, Master Bond EP21FRNS-2 passes UL 94V-0 testing for flame retardancy in potting, encapsulation and casting applications. It produces very low smoke levels and is well suited for the computer, aerospace and related industries.
In an effort to mitigate the more complicated preparation associated with B-staged epoxies, Master Bond developed FLM36 for bonding and sealing applications in the aerospace, electronic, opto-electronic and specialty OEM industries. This B-staged film eliminates mixing and measuring and is easy to handle.
Suitable for high production applications, Master Bond UV25 offers fast fixture times, rapid curing and high temperature resistance. This multifunctional one component UV curable system was developed for bonding, sealing, coating and encapsulation applications. It is widely used in aerospace, fiber-optic, optical, electronic and related industries.
Featuring softness and resilience, Master Bond Super Gel 9 is a urethane modified epoxy gel that can be employed in a variety of applications. Some of the most common include the encapsulation of sensitive electronic parts and sealing optical components. This multifunctional system is also widely used in the aerospace, electronic, optical, electro-optical and other specialty industries.
With the ability to withstand acids, bases and many solvents, Master Bond EP62-1 is primarily used as an adhesive, sealant or coating where the epoxy will be exposed to very harsh conditions. This two part epoxy features thermal stability with a glass transition temperature exceeding 170°C.
Master Bond LED401 is a breakthrough system based on LED technology. This adhesive, sealant, coating and encapsulant cures tack-free upon exposure to a 405 nm wavelength light source, without any oxygen inhibition. Optically clear, it is also safer and easier to handle than similar UV systems as LED lights emit substantially less heat than UV lamps.