Featuring the combination of electrical insulation properties and thermal conductivity, Master Bond Supreme 3HTND-2GT can be used for a variety of applications including bonding, sealing, glob top and die attach. This toughened epoxy system bonds well to a wide variety of substrates used in electronics, including metals, composites, ceramics and many plastics.
New, easy to read, 32 page catalog offers performance and processing data on Master Bond’s extensive line of epoxy, silicone, polyurethane, silicate based and light curing compounds. These products provide solutions to PCB assembly, die-attach, conformal coating, surface mount, lid sealing, chip and wire bonding applications.
Featuring a thick paste consistency, Master Bond EP21NDFG bonds well to a variety of substrates including metals, composites, glass, ceramics and many types of rubbers and plastics. Unlike many high viscosity systems, EP21NDFG is truly non-drip and will not run or sag, even when applied to vertical surfaces.
In addition to typical silicone properties such as flexibility and high temperature resistance, Master Bond MasterSil 156 passes the rigorous UL 94V-0 tests for flame retardancy. This two part silicone system is addition cured and does not require exposure to air for complete cross-linking. It has a convenient one to one mix ratio by weight and will not outgas while curing.
Master Bond Supreme 45HTQ is a thermally stable, two component quartz filled epoxy system. It features exceptional abrasion and chemical resistant properties. It will withstand exposure to petrochemicals, acids, bases and solvents. It retains its performance profile at elevated temperatures up to +450°F.
Suitable for large castings, Master Bond EP21LVSP6 combines a low viscosity and low exotherm with a working life of 3-5 hours. It can also be used for bonding, sealing and coating applications in aerospace, electronic, electrical, optical and other specialty industries.