News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	One Part RTV Silicone Passes Non-Cytotoxicity Standards Release Date: 11/01/2023 Product: MasterSil 711Med Designed for medical device manufacturing, MasterSil 711Med passes ISO 10993-5 testing. It is a one part, flowable, room temperature vulcanizing (RTV) silicone which needs no mixing, and can be used for bonding, sealing, coating and form-in-place gasketing applications. This non-corrosive, translucent compound withstands many… Read More...
	Toughened, One Component Epoxy Features High Glass Transition Temperature Release Date: 10/12/2023 Product: Supreme 17HTND-2 Master Bond Supreme 17HTND-2 is a toughened epoxy system for bonding and sealing applications. It is a true one component system, not premixed and frozen, with an unlimited working life at room temperature. Supreme 17HTND-2 is thermally stable, featuring a high glass transition temperature (T_g) of 410°F (210°C). It… Read More...
	Electrically Insulative Two Component Epoxy Features High Elongation Release Date: 09/19/2023 Product: EP21LVFL Master Bond EP21LVFL combines good flexibility with a solid strength profile. It is curable at room temperature with a long working life of 120-160 minutes at 75°F for a 100 gram batch and features a flowable initial mixed viscosity of 10,000-14,000 cps. This epoxy generates low exotherm making it suitable not only for bonding… Read More...
	Thermally Conductive, Electrically Insulative Epoxy for Medical Device Applications Release Date: 07/31/2023 Product: EP40TCMed Master Bond EP40TCMed is a two part, room temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity. It is thermally conductive, electrically non-conductive and can be utilized as an adhesive or sealant in various medical and wearable device applications. This toughened… Read More...
	One Part, Toughened Epoxy for Dam-and-Fill Encapsulation Release Date: 07/14/2023 Product: Supreme 3DM-85 Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications. It can also be utilized for bonding and sealing, especially where no flow is needed since the material cures in place and… Read More...