Master Bond offers advanced polymer systems for the manufacturing of food processing equipment. Our epoxy systems conform to Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 requirements for food safety. Specific formulations have also been independently tested and passed stringent FDA CFR 175.300 specification and the NSF/ANSI 51.4.1 (2009) standard for food applications.
Properties of Food Grade Systems
These high performance polymers may be used across a wide variety of applications in the food industry and offer many beneficial characteristics including:
- Excellent resistance to chemicals such as boiling water, fats, oils, acids, alkalis and many solvents
- Capability of withstanding extreme conditions
- Resistance to steam, radiation and frozen storage conditions
- Convenient handling
Some Popular Epoxy Adhesives for Food Processing Applications
Food grade epoxy system toxicologically evaluated to meet the NSF/ANSI 51.4.1 (2009) standard for food equipment materials. Certified to meet FDA CFR 175.300. Excellent resistance to fats, oils, acids, alkalis and many solvents. Withstands boiling water, radiation, chemicals, steam and frozen storage conditions. Strong bonds to similar/dissimilar substrates. Service temperature range -60°F to +450°F. Low viscosity.
High temperature resistant, room temperature curing epoxy system. Exceptional bond strength and dimensional stability. Optically clear. Meets FDA Chapter 1, Section 175.105 requirements. Easy to apply. Serviceable from -60° to +400°F. Protects against exposure to water, oils, fuels, acids, bases and many solvents. Rigid system. Impressive electrical insulation values.
High performance epoxy adhesive, sealant and coating. Superior physical strength properties. Bonds well to similar and dissimilar substrates. Conforms to FDA Chapter 1, Section 175.105 specification for indirect food contact. Solvent free system. Optically clear. Rigid bonds. Outstanding chemical resistance. Room temperature curing. Serviceable from -60°F to +300°F.
Epoxy adhesive, sealant, coating resists acids, alkalis and many solvents. Low viscosity room temperature curing. Contains no solvents. Serviceable from -60°F to +300°F. Castable to thicknesses exceeding 2-3 inches. Excellent electrical insulator.